Bonding Pad Structure Spacing for Water Vapor Protection
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Solution Overview
Problem
Conventional electronic products are prone to damage from water vapor, which can lead to conductive path breakdown and reduced lifespan due to the proximity of bonding pads to edges, allowing easy invasion of water vapor.
Innovation Solution
Incorporating a specific spacing of at least 100 μm between the connecting holes and the edge of the bonding pad structure, increasing the path length for water vapor to reach the metal pattern, thereby protecting the bonding pad and enhancing the reliability and lifespan of electronic products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the bonding pad structure is disposed close to the edge of the substrate, then the area for electrical connection is improved, but the bonding pad becomes vulnerable to water vapor damage
Solution Approach 1:
The patent introduces an intermediary protective structure consisting of a first insulating layer and a second insulating layer that fill and cover the connecting hole, creating a barrier between the metal pattern and the external environment. This intermediary protective structure prevents water vapor from directly reaching the metal pattern through the connecting hole, thereby resolving the vulnerability caused by the bonding pad's proximity to the edge
2Ease of manufacture
If the connecting hole is positioned close to the edge of the bonding pad, then the manufacturing process is simplified, but the metal pattern is exposed to water vapor erosion
Solution Approach 1:
The patent applies preliminary anti-action by pre-filling the connecting hole with a first insulating layer and pre-covering it with a second insulating layer before any water vapor damage can occur. This preliminary protective measure ensures that even when the connecting hole is positioned close to the edge for manufacturing simplicity, the metal pattern is already protected from water vapor erosion
Solution Approach 2:
The patent uses composite materials by combining multiple insulating layers (first insulating layer and second insulating layer) to create a multi-layer protective structure. This composite protective structure provides enhanced protection against water vapor compared to a single layer, addressing the harmful effects while maintaining manufacturing feasibility
Data Source
AI summary
An electronic product includes a substrate and a bonding pad structure. The bonding pad structure is disposed on the substrate, and the bonding pad structure includes a first metal layer, a first insulating layer, at least one first connecting hole and a transparent conductive layer. The first metal layer and the first insulating layer are disposed on the substrate. The first connecting hole is situated in the first insulating layer, and the first connecting hole exposes a portion of the first metal layer. The transparent conductive layer is disposed on the first insulating layer, and the transparent conductive layer has a first edge and a second edge opposite to the first edge, wherein the transparent conductive layer is electrically connected to the first metal layer through the first connecting hole. A spacing between the first edge and the first connecting hole is greater than or equal to 100 μm.