3D Bonding Pad Structure for High-Density Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing bonding pads in electronic devices face challenges when scaled down, leading to electron transfer between adjacent metal layers, causing signal errors due to insufficient separation distance, which affects the reliability of electronic devices.
Innovation Solution
The bonding pad structure incorporates a stereometric design with conductive layers having different distances from the substrate, ensuring separation even when pads are closely arranged, reducing electron transfer by maintaining a separation distance between adjacent conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If bonding pads are scaled down and arranged closer together, then device integration and density are improved, but electron transfer between adjacent metal layers occurs causing signal errors
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar arrangement of bonding pads to a three-dimensional stacked configuration. Multiple bonding pads are arranged vertically across different layers (first bonding pad on first substrate, second bonding pad on second substrate) and connected through conductive structures (via holes, conductive adhesive layers). This vertical stacking enables higher integration density while maintaining adequate separation distances between adjacent pads, thereby preventing electron transfer and signal errors.
2Area of stationary object
If bonding pads are arranged closer together, then substrate area utilization is improved, but separation distance between adjacent conductive layers becomes insufficient leading to electron transfer
Solution Approach 1:
The patent implements nesting by placing bonding pads and conductive structures within each other across multiple layers. The first bonding pad is nested with the second bonding pad through vertical alignment and connection via conductive adhesive layers and via holes. This nested arrangement maximizes substrate area utilization while maintaining proper spacing and electrical isolation between adjacent conductive layers, preventing electron transfer.
3Ease of manufacture
If conventional bonding pad structures are used, then manufacturing simplicity is maintained, but electron transfer causes signal errors reducing device reliability
Solution Approach 1:
The patent employs composite materials by combining different conductive materials in a multi-layer bonding pad structure. The structure includes a first bonding pad, a conductive adhesive layer, a second bonding pad, and conductive filler particles within via holes. This composite construction maintains manufacturing feasibility while providing adequate electrical isolation between layers, preventing electron transfer and signal errors.
Data Source
AI summary
An electronic device includes a substrate, a first conductive structure, a second conductive structure, a first wire, and a second wire. The substrate includes a peripheral region. The first conductive structure is in the peripheral region and includes a first conductive layer and a second conductive layer. The first and the second conductive layer are arranged along a first direction. The second conductive structure is in the peripheral region and includes a third conductive layer. The first and the second conductive structure are arranged along a second direction, which is perpendicular to the first direction. The first wire is in the peripheral region and is electrically connected between the first and the third conductive layer. The second wire is in the peripheral region and is electrically connected to the second conductive layer. The first wire is adjacent to the second wire along the first direction.