Printed Circuit Aspects TRIZ Cases

Conical sleeves enable reliable electrical connections while allowing easy component removal without damaging the board or device.

Smart pins expand mechanically to create reliable electrical pathways, eliminating thermal damage from soldering during high-density circuit assembly.

A printed circuit board design uses a dielectric passage to reduce pad capacitance while maintaining signal impedance.

Resin filling shields hole copper during back-drilling, enabling acidic etching to remove only metal scraps without reducing aperture or causing copper loss.

A package structure positions heat conductors in the heat-generating area of electronic components to extract thermal energy.

Multi-layer printed wiring board embeds opposing conductor circuits within insulating layers to enable precise fingerprint sensing.

Conductive filled vias and frame portions establish co-planar surfaces on flexible substrates for light emitting semiconductor device mounting.

Selective boundary cappings on graphene layer defects inhibit substrate corrosion, reducing gold coating costs while maintaining signal integrity.

Organic photovoltaic panels power flexible microfluidic sweat sensor patches, eliminating bulky batteries and enabling continuous health monitoring.

A display panel reorients connecting terminals vertically within the lower bezel to reduce width while maintaining bonding area.

Non-equal spacing pitches in multi-point wiring minimize simultaneous superimposition of ring-back and capacity reflection components.

Widening the connecting portion of a touch-sensing electrode to reduce static electricity density per unit area.

Grinding via conductors forms grooves to remove residual ceramic layers, improving platability and connection reliability in stacked-layer boards.

Staggered bridge conductors in a thin transmission line reduce crosstalk and improve isolation between adjacent high-frequency signal paths.

A print head uses an expansion element to widen the flow cross section and a detachable output filter to remove debris from the fluid path.

A printed circuit board integrates a ceramic thermally conductive element between insulating layers to move heat away from electrical components.

A radiant heat circuit board uses a metallic plate with a copper-plated protrusion to mount heat emitting devices directly.

Shielding plate notches lock flippable connectors, eliminating costly MUX integration and signal degradation.

Laminated circuit board structure uses lateral grooves to define precise back drilling depth limits.

A dual SD card design houses two separate memory circuits within a single enclosure, each with its own electrical contacts.

Removing the bottom wall from the connector housing reduces device height while maintaining electrical connection stability through lateral fixation.

Insulating auxiliary members with distinct thermal expansion properties embedded in the core layer balance substrate stresses.

Thick inner conductor layer conducts heat from components through vias to connection pads, reducing thermal resistance in printed wiring boards.

Sandblasting forms via holes in tapered pads to expose intermediate portions, improving interlayer connection reliability.

A chip resistance element integrates a third terminal with a side portion to enhance adhesion strength on the base substrate.

Liquid phase power connects relieve thermal stress through phase transitions, enabling reliable high-temperature operation beyond 250°C.

Segmented electroless plating films with concave surfaces reduce reflectance while improving adhesion between the base material and the plating layer.

A three-dimensional bonding pad structure uses vertically stacked conductive layers to maintain separation between adjacent components.

A printed wiring board embeds thermal conductors to direct heat flux across distinct substrate regions.

Blind holes with conductive members connect stacked substrates, eliminating complex side jumpers and improving manufacturing efficiency.

Controlling resin thickness ratios on glass cloth suppresses warp in metal-clad laminates without sacrificing machinability or increasing transmission loss.

Secondary material layers create voids within plated through-holes to eliminate conductive stubs and reduce noise radiation in high-frequency applications.

A terahertz radiation emitter and receiver measure electric field amplitude to determine ink conductivity without physical contact.

A flexible wiring board housing uses a slit and wider stoppers to secure the connector interface.

Segmented terminal electrodes and counter electrodes connect via anisotropic conductive film to improve alignment during crimping.

Segmented solder resist layers accommodate terminal height variations and prevent bridges while maintaining circuit board protection.

Elastic PCB contact elements in a movable plastic housing absorb vibrational loads, preventing wear and ensuring reliable electrical connections.

A vinyl-compound-based resin composition with bifunctional phenylene ether oligomer and cyanate ester resins enhances moldability.

A wiring board uses differentiated copper particle sizes in via conductors and conductor layers to enhance high-frequency interface conductivity.

A clamshell enclosure separates wet and dry zones in liquid-cooled electronics.

A layered manufacturing process integrates printed circuits and microchannels into biocompatible substrates for portable lab-on-chip devices.

A wiring substrate uses a resin insulating layer with inorganic particles concentrated in the lower portion to maintain surface smoothness.

A palladium coating composition stabilizes deposition on nickel substrates using complexing agents and reducing agents.

A hybrid transparent conductor combines P-type doped graphene islands with entangled metal nanowires to form a continuous conductive network.

Segmenting the insulating core into two half-shells with inner terminal grooves eliminates Mylar film requirements and simplifies assembly.

Aromatic polyester amide film reduces transmission loss in high frequency bands while suppressing wiring distortion through controlled elastic modulus at 160°C.

A ceramic circuit board with a recessed metal plate reduces interface stress and prevents substrate cracking during heat cycles.

A TFT array substrate integrates Schottky diodes directly on the non-display area to eliminate separate flexible printed circuit assembly components.

Reference planes separate conductive signal pads to minimize high-speed signal interference.

Protruding adhesive structures reduce thermal expansion mismatch between conductor and resin insulating layers, preventing peeling under stress.