Stacked Substrate Blind Hole Interconnects for Signal Transmission
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Solution Overview
Problem
Conventional methods for signal transmission between the upper and lower surfaces of electronic devices, such as drilling holes and using side jumpers, are inefficient and lack a direct, effective means to connect circuits through blind holes.
Innovation Solution
An electronic device design featuring stacked substrates with conductive channels and pads, where conductive members are placed within these channels to establish electrical connections between the outermost layers, allowing for signal transmission through blind holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional drilling holes and electroplating process are used to connect circuits on upper and lower surfaces, then electrical connection is achieved, but manufacturing complexity and time are increased
Solution Approach 1:
The patent divides the substrate into multiple layers with conductive channels formed at different depths (first blind holes in first substrate, second blind holes in second substrate). This segmentation allows each layer to be processed independently and then bonded together, simplifying the overall manufacturing process while maintaining reliable electrical connection.
Solution Approach 2:
The conductive channels (blind holes) are formed in the substrates before bonding. This preliminary action allows the channels to be prepared in advance, and the substrates are then bonded together with the channels already in position, eliminating the need for post-bonding drilling and plating operations.
2Reliability
If side jumpers are used to connect circuits from the side of the electronic device, then signal transmission is achieved, but device area and complexity are increased
Solution Approach 1:
Instead of using side jumpers that extend laterally across the device surface, the patent transitions to vertical blind holes that pass through the substrate thickness. This dimensional change from lateral to vertical connection eliminates the need for additional device area while achieving the same signal transmission function.
3Reliability
If through holes are drilled and plated to connect upper and lower surfaces, then electrical connection is achieved, but manufacturing time and cost are increased
Solution Approach 1:
The patent extracts the conductive channels from being through-holes that penetrate the entire substrate to being blind holes that terminate within the substrate layers. This extraction eliminates the need for plating the entire through-hole length and allows for more efficient bonding processes, improving manufacturing productivity.
4Reliability
If multiple substrates are stacked with blind holes and conductive members, then signal transmission between outermost layers is achieved, but structural complexity is increased
Solution Approach 1:
The patent implements a nested structure where first substrates are placed within recesses of second substrates, and conductive members are nested within the blind holes. This nesting approach organizes the complex multi-layer structure in a compact manner, making the overall device more manageable despite the increased number of components.
Data Source
AI summary
An electronic device includes a first substrate and a second substrate stacked on each other, a plurality of pad groups, a plurality of channels, and a plurality of conductive members. The first substrate and the second substrate respectively have an inner surface facing to each other and an outer surface away from each other. Each pad group includes two conductive pads, which are respectively disposed at the outer surfaces of the first substrate and the second substrate and are located corresponding to each other. The channels pass through the first substrate and the second substrate, and each channel is disposed corresponding to one of the pad groups. Two ends of each channel are respectively sealed by the two conductive pads of the corresponding pad group. The conductive members are disposed in the channels, and each conductive member is electrically connected to the two conductive pads of the corresponding pad group.