Wiring Substrate With Local Quality Resin Insulating Layer
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Solution Overview
Problem
Current multilayer substrates face challenges in achieving high flatness and smoothness for signal wiring formation, particularly with glass substrates, due to the difficulty in uniformly forming inorganic particles within resin insulating layers and maintaining the flatness of the substrate surface.
Innovation Solution
A wiring substrate design featuring a glass core substrate with through-hole conductors, a resin insulating layer containing inorganic particles, and a conductor layer formed by sputtering and electrolytic plating, where the resin insulating layer's surface is smooth and free of inorganic particles, allowing for fine signal wiring formation and efficient via conductor connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic particles are uniformly dispersed in the resin insulating layer, then the insulating performance is improved, but the surface flatness and smoothness deteriorate
Solution Approach 1:
The patent applies local quality by having inorganic particles concentrated in the lower portion of the resin insulating layer while keeping the upper surface free of particles. This is achieved by controlling the dispersion depth during manufacturing, allowing the lower region to provide insulating performance while the upper surface maintains flatness and smoothness for subsequent wiring formation.
2Strength
If the resin insulating layer contains inorganic particles throughout, then the mechanical strength is improved, but the surface smoothness for signal wiring formation deteriorates
Solution Approach 1:
The patent implements local quality by creating a vertical gradient in particle distribution within the resin insulating layer. The lower portion contains inorganic particles to provide mechanical strength and structural integrity, while the upper portion near the surface is kept free of particles to ensure smoothness and flatness for precise signal wiring formation.
3Manufacturing precision
If the substrate surface is made flat and smooth for fine wiring, then the wiring precision is improved, but the particle distribution uniformity in the resin layer deteriorates
Solution Approach 1:
The patent resolves this contradiction by applying local quality with vertical zonation of particle distribution. The resin insulating layer is structured so that inorganic particles are present in the lower region for compositional stability and strength, while the upper surface region is kept particle-free to enable high-precision wiring formation with excellent flatness and smoothness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures high-quality, flat, and smooth signal wiring with reduced noise and propagation speed differences, enhancing the reliability of logic ICs even with longer signal wirings, while maintaining the flatness and smoothness of the substrate surface.
Implementation Method 1
a conductor layer formed on a surface of the resin insulating layer and including a seed layer formed by sputtering
Implementation Method 2
an electrolytic plating layer formed on the seed layer such that the conductor layer includes signal wirings
Data Source
AI summary
A wiring substrate includes a core substrate including a glass substrate, a resin insulating layer including inorganic particles and resin, a conductor layer including a seed layer and an electrolytic plating layer such that the conductor layer includes signal wirings, and a via conductor formed in an opening formed in the resin insulating layer and including the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a through-hole conductor formed such that the core substrate has a through hole penetrating through the glass substrate and the through-hole conductor is formed in the through hole, the via conductor is electrically connected to the through-hole conductor formed in the core substrate, and the resin insulating layer is formed such that the surface upon which the conductor layer is formed includes the resin and an inner wall surface in the opening includes the resin and inorganic particles.