Ceramic Inlay Printed Circuit Board for Vacuum Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing printed circuit boards face challenges in achieving high thermal conductivity and high-voltage insulation, particularly in vacuum environments where convection cooling is not possible, making it difficult to dissipate heat from electrical components in high-voltage systems like satellites.
Innovation Solution
A multi-layer printed circuit board with a ceramic thermally conductive element sandwiched between insulating layers, providing both effective heat dissipation and high-voltage insulation, utilizing ceramic materials like aluminum nitride for enhanced thermal conductivity and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional epoxy-glass printed circuit board material is used, then the board provides electrical insulation and mechanical support, but the thermal conductivity is insufficient for effective heat dissipation in vacuum environments
Solution Approach 1:
The patent applies composite materials by integrating a ceramic core substrate with epoxy-glass layers. The ceramic material provides high thermal conductivity for effective heat dissipation, while the epoxy-glass layers provide electrical insulation and mechanical support. This composite structure resolves the contradiction by combining materials with complementary properties to achieve both thermal management and electrical insulation requirements.
Solution Approach 2:
The patent applies local quality by placing the thermally conductive ceramic core substrate specifically in regions requiring heat dissipation, while maintaining epoxy-glass insulation layers in other areas. This localized approach allows different regions of the circuit board to have optimized properties - thermal conductivity where needed and electrical insulation where required - resolving the contradiction between heat dissipation and insulation requirements.
2Temperature
If thermally conductive materials are added to improve heat dissipation, then thermal conductivity increases, but the electrical insulation capability may be compromised
Solution Approach 1:
The patent applies segmentation by dividing the circuit board into distinct functional layers: a central ceramic core substrate for thermal conduction, surrounded by epoxy-glass insulating layers. This segmentation allows the thermally conductive ceramic material to be isolated from electrical conductors by the insulating epoxy-glass layers, enabling high thermal conductivity in the core while maintaining electrical insulation throughout the structure.
Solution Approach 2:
The patent applies the intermediary principle by using the epoxy-glass insulating layers as mediators between the thermally conductive ceramic core and the electrical conductors. These intermediary layers prevent direct electrical contact with the conductive ceramic, thereby maintaining electrical insulation while still allowing thermal energy to be conducted through the ceramic core to heat sinks.
3Reliability
If the circuit board structure is modified to include ceramic inlays, then thermal conductivity and high-voltage insulation are improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies merging by integrating the ceramic core substrate directly into the multi-layer epoxy-glass structure during the manufacturing process. The ceramic core is positioned within recesses of the insulating layers, and conductor tracks are formed on its surface. This merging of the ceramic element with the existing PCB lamination process reduces manufacturing complexity compared to assembling separate ceramic components, while still achieving improved high-voltage insulation and thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic thermally conductive element enables efficient heat conduction and insulation, ensuring reliable operation in high-voltage systems by preventing voltage flashover and effectively dissipating heat through conduction and radiation in vacuum conditions.
Implementation Method 1
the thermally conductive element enables heat conduction, in particular heat dissipation, from the first outer surface and the electrical components to the second outer surface
Implementation Method 2
effectively dissipating heat through conduction and radiation in vacuum conditions
Implementation Method 3
ensuring reliable operation in high-voltage systems by preventing voltage flashover
Data Source
Figure 1~2
AI summary
A printed circuit board (100) is described, designed to be populated with electrical components (200). The printed circuit board has a plurality of conductor layers (110, 120, 130) arranged one above the other, with each pair of adjacent conductor layers being insulated from each other by an insulating layer (190A, 190B, 190C, 190D). The printed circuit board is characterized in that a thermally conductive element (300) comprising ceramic is arranged between a first outer insulating layer and a second outer insulating layer. Thus, a printed circuit board constructed in this way provides both good thermal conductivity and electrical insulation against voltage flashovers.