Layered Lab-on-Chip Manufacturing with Integrated Electronics
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Solution Overview
Problem
The high cost, slow manufacturing processes, and difficulty in industrializing lab-on-chip devices limit their scalability and affordability for widespread use in various sectors.
Innovation Solution
A layered manufacturing process using biocompatible materials like PMMA, COC, and silicon, which integrates printed electronic circuits and microchannels, allowing for the creation of portable, cost-effective, and easily reproducible lab-on-chip devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional manufacturing processes are used for lab-on-chip devices, then manufacturing precision and reliability are maintained, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The device is divided into multiple functional layers (microfluidic layer, electronic layer, substrate layer) that can be manufactured separately using optimized processes for each layer type, then assembled together. This segmentation allows parallel manufacturing of different layers, improving overall productivity while maintaining precision through specialized processes for each layer.
Solution Approach 2:
The patent combines microfluidic channels, electronic circuits, and sensing elements into a single integrated device structure. By merging these previously separate components into one unified manufacturing process, the patent eliminates multiple assembly steps, reduces manufacturing complexity, and improves productivity while maintaining the reliability of each component.
2Productivity
If high-cost materials and specialized manufacturing methods are used, then device reliability and performance are improved, but manufacturing cost increases and scalability decreases
Solution Approach 1:
The patent employs universal manufacturing processes such as photolithography, sputtering, and standard PCB fabrication techniques that are already widely used in the semiconductor and electronics industries. These universal processes enable serial manufacturing and scale production without requiring specialized or custom equipment, thereby improving productivity and industrialization capability while maintaining device reliability.
Solution Approach 2:
The patent optimizes material selection and process parameters to balance performance requirements with manufacturing efficiency. By adjusting parameters such as metal layer thickness, polymer material selection, and processing temperatures within standard ranges, the patent achieves reliable device performance using conventional manufacturing processes that support serial production and scalability.
3Adaptability or versatility
If complex multi-layer structures are integrated, then device functionality and analytical capabilities are improved, but manufacturing complexity and production time increase
Solution Approach 1:
The patent incorporates electronic circuits, sensors, and microfluidic features directly during the manufacturing process rather than adding them as post-processing steps. For example, conductive traces are deposited during the same sputtering process used for electronic layers, and microchannels are formed during layer fabrication. This preliminary integration of multiple functions into the manufacturing process itself reduces overall manufacturing time while maintaining complex analytical capabilities.
Solution Approach 2:
The patent employs a layered structure where smaller functional elements are embedded within larger structural layers. Electronic circuits are nested within the microfluidic device body, sensors are integrated within channel walls, and multiple functional layers are stacked together. This nesting approach allows complex functionalities to be achieved through systematic layering rather than sequential assembly, thereby reducing manufacturing time while maintaining versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the rapid, economical, and serial production of lab-on-chip devices, reducing costs and improving efficiency, while maintaining biocompatibility and enabling advanced analytical functionalities.
Implementation Method 1
Metallization is based on the adhesion of a prefabricated metal layer to the biocompatible substrate through the use of a resin
Implementation Method 2
microchannels or holes are engraved, cut, drilled or stamped (by laser, for example)
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
Laboratory on chip and its layered manufacturing method, wherein the method includes: designing, by means of a computer program, a printed circuit (7), mixing and reaction cavities (3) of fluids, microchannels (2) and spaces (15) for the placement of electronic components to be found in each layer, mechanizing in one or more biocompatible substrates the different voids and passages that will make up the mixing and reaction cavities (3), microchannels (2), holes (8) that join the microchannels and spaces for the subsequent placement of electronic components (15), metallizing with a biocompatible conductive material those surfaces in which the printed circuit will be integrated (7) according to the design performed in the first step, generating the printed circuit (7) by photolithography and acid attack, bonding the electronic components in the corresponding spaces (15), joining all the layers that make up the final laboratory.