Package Structure Heat Conductor Placement for Thermal Management
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Solution Overview
Problem
The increasing power output of electronic products leads to excessive heat emission by electronic components, reducing their performance due to elevated temperatures, necessitating improved heat dissipation in package structures.
Innovation Solution
A package structure incorporating a substrate with electronic components and heat conductors, where the heat conductors are positioned in the heat-generating area, and an encapsulant with a heat dissipation structure, optimizing the height ratios and material selection to enhance heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power output of electronic products is increased, then the performance and capability of the products are improved, but the heat emission by electronic components increases, causing temperature rise and performance reduction
Solution Approach 1:
The patent extracts the heat-generating function from the electronic component and separates it from the heat-dissipating function by introducing dedicated heat conductors. These heat conductors are positioned to contact the heat-generating area of the electronic component, extracting heat away from the component to the heat dissipation structure, thereby resolving the temperature rise issue while maintaining high power output
Solution Approach 2:
The patent introduces heat conductors as intermediary elements between the electronic component and the heat dissipation structure. These heat conductors serve as thermal mediators, facilitating efficient heat transfer from the electronic component's heat-generating area to the heat dissipation structure, enabling effective thermal management without compromising the component's power output
2Temperature
If heat conductors are added to improve heat dissipation, then the temperature control is improved, but the device complexity and structural design become more complex
Solution Approach 1:
The patent merges the heat conduction function with the existing package structure by integrating heat conductors into the substrate or housing. The heat conductors are positioned to contact the heat-generating area and are structurally combined with the substrate, eliminating the need for separate, complex heat dissipation assemblies while achieving effective temperature control
Solution Approach 2:
The patent applies local quality by positioning heat conductors specifically in the heat-generating area of the electronic component rather than uniformly throughout the structure. The heat conductors are strategically placed where thermal contact is most needed, optimizing heat dissipation efficiency while minimizing additional structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the temperature of electronic components, improving the overall heat dissipation and reliability of the package structure by efficiently conducting heat away from the components.
Implementation Method 1
the at least one heat conductor is disposed in the heat-generating area... effectively conduct the heat emitted by the electronic components
Implementation Method 2
a heat dissipation structure disposed on the encapsulant... improve the overall heat dissipation effect of the package structure
Data Source
AI summary
A package structure includes a substrate having a bearing surface, an electronic component disposed on the bearing surface and having a first height, at least one heat conductor disposed on the bearing surface and having a second height, an encapsulant disposed on the bearing surface and having a side covering the electronic component and the at least one heat conductor and a third height, and a heat dissipation structure disposed on the encapsulant. The third height is greater than or equal to the first height and the second height. A surrounding area where the substrate is in contact with the electronic component is a heat-generating area, and the at least one heat conductor is disposed in the heat-generating area.