Printed Wiring Board Thick Inner Conductor Heat Dissipation
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Solution Overview
Problem
Existing printed wiring boards face challenges in achieving efficient heat dissipation due to the use of insulating materials with low thermal conductivity and potential gaps at interfaces, which hinder effective heat transfer from electronic components to the substrate and conductive members.
Innovation Solution
A printed wiring board design featuring a thick inner conductor layer with via conductors connecting it to outer conductor layers, where component mounting pads and connection pads extend beyond the component mounting region, facilitating heat dissipation through a high thermal conductivity path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating materials are used in printed wiring boards, then electrical insulation is achieved, but thermal conductivity deteriorates due to low thermal conductivity of insulating materials
Solution Approach 1:
The printed wiring board is divided into multiple conductor layers separated by insulating layers. The thick inner conductor layer is segmented into multiple regions including component mounting regions and connection regions, allowing different thermal management strategies in different areas while maintaining electrical insulation through the insulating layers.
Solution Approach 2:
The invention transitions from two-dimensional surface mounting to three-dimensional multi-layer conductor structure. By adding the thick inner conductor layer at a different depth dimension and connecting it via via holes, the patent creates a vertical thermal conduction path that complements the horizontal surface conduction, effectively managing heat in three-dimensional space.
2Ease of manufacture
If gaps exist at interfaces between components and substrate, then assembly tolerance is achieved, but heat transfer efficiency deteriorates due to thermal resistance at interfaces
Solution Approach 1:
The component mounting pad and the inner conductor layer are merged into a unified thermal conduction system. The via holes act as connectors that merge the surface mount structure with the internal thick conductor layer, creating a continuous thermal path that bypasses the problematic component-substrate interface gaps.
Solution Approach 2:
The thick inner conductor layer acts as an intermediary thermal conduction medium. Instead of relying on direct contact between the component and the substrate (which has gaps), heat is transferred to the inner conductor layer through the pad-via-conductor chain, which then serves as an intermediary to conduct heat away from the component.
3Manufacturing precision
If component mounting pads are confined to the component mounting region, then component placement precision is achieved, but heat dissipation area is reduced
Solution Approach 1:
The heat dissipation structure extends from the two-dimensional surface pad into the third dimension by incorporating the thick inner conductor layer. The via holes provide vertical connectivity, allowing the mounting pad to thermally connect to the extensive internal conductor area, effectively increasing the heat dissipation volume without compromising surface placement precision.
Solution Approach 2:
The conductor structure is segmented into surface-level mounting pads for precise component placement and subsurface thick inner conductor layers for heat dissipation. This segmentation allows the mounting region to remain compact and precise while the thermal management function is handled by the extended internal conductor structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation by allowing heat to be efficiently conducted from electronic components to the thick inner conductor layer and further dissipated via connection pads to external elements, improving thermal management and reducing thermal resistance.
Implementation Method 1
heat to be efficiently conducted from electronic components to the thick inner conductor layer and further dissipated via connection pads
Data Source
AI summary
A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.