Multi-layer Circuit Member with Reference Planes and Ground Layer
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Solution Overview
Problem
Existing multi-layer circuit designs face challenges in minimizing the impact of high-speed signals from one channel on other channels, as they often lead to signal interference due to inadequate separation and grounding arrangements.
Innovation Solution
A multi-layer circuit member is designed with conductive signal pads and reference/ground planes, separated by dielectric layers and connected via conductive vias, featuring a specific arrangement of signal and ground pads to maximize separation and reduce interference, including a Y-shaped structure for neighboring grounding pads to enhance signal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If signal pads are arranged closely to increase channel density, then productivity is improved, but signal interference between channels increases
Solution Approach 1:
Ground pads are introduced as intermediary elements positioned between adjacent signal pads. These ground pads act as mediators that electrically isolate neighboring signal channels, preventing signal interference while allowing the signal pads to remain in close proximity for high channel density.
Solution Approach 2:
The circuit board surface is segmented into alternating signal pads and ground pads, creating distinct electrical zones. This segmentation pattern divides the continuous conductive area into isolated segments, preventing electromagnetic coupling between adjacent signal channels while maintaining spatial efficiency.
2Reliability
If ground pads are added between signal pads to reduce interference, then signal isolation is improved, but device complexity increases
Solution Approach 1:
The circuit board employs a homogeneous alternating pattern of signal pads and ground pads throughout the conductor layer. This uniform repetition of the signal-ground-signal sequence simplifies the design process and manufacturing, as the same basic unit is repeated across the entire board rather than requiring complex custom arrangements.
3Adaptability or versatility
If multiple conductive layers are used to improve signal routing, then adaptability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Multiple ground layers are positioned adjacent to signal layers, creating equipotential reference planes on both sides of each signal conductor. This symmetric grounding arrangement provides stable reference potentials that reduce crosstalk and electromagnetic interference, improving signal integrity without requiring extremely tight manufacturing tolerances.
Data Source
AI summary
A multi-layer circuit member includes: a first layer formed of a conductive material, the first layer including plural signal pads and a first reference plane spaced apart from the signal pads, the first reference plane including an outer region surrounding the signal pads and an inner region separating the plurality of signal pads; a second layer formed of a conductive material, the second layer including plural signal conductors and a second reference plane spaced apart from the signal conductors, the second reference plane including an outer region surrounding the signal conductors and an inner region separating the signal conductors; a ground layer disposed at a side of the second layer opposite from the first layer; plural dielectric layers separating the first layer, the second layer, and the ground layer.