Radiant Heat Circuit Board With Copper-Plated Protrusion
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Solution Overview
Problem
Conventional radiant heat circuit boards fail to effectively transfer heat from heat-emitting devices to metallic plates due to interference from insulating layers, leading to reduced thermal efficiency and reliability.
Innovation Solution
A radiant heat circuit board design featuring a metallic plate with a heat radiation protrusion and a bonding layer plated with copper, allowing direct heat transfer and improved adhesive properties with solder, enhancing thermal efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is provided between the heat emitting device and metallic plate, then electrical insulation is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The insulating layer is segmented to provide both electrical insulation and thermal conduction paths. By dividing the insulating layer into specific regions (first insulating layer and second insulating layer with different properties), the patent achieves electrical isolation while maintaining heat transfer capability through the segmented structure
Solution Approach 2:
Different regions of the insulating layer have different thermal and electrical properties. The first insulating layer has specific dielectric strength requirements (500V or higher) while the second insulating layer has different thermal conductivity characteristics, allowing optimal performance in each local region for both insulation and heat transfer
2Loss of energy
If a metallic plate with heat radiation protrusion is used, then heat radiation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat radiation protrusion is formed on the metallic plate before assembling the circuit board components. This preliminary formation of the protrusion structure allows for simplified subsequent assembly processes and reduces overall manufacturing complexity while maintaining effective heat radiation capability
Solution Approach 2:
The metallic plate serves multiple functions: it provides structural support, electrical grounding, and heat radiation. The heat radiation protrusion integrates these functions by being both a structural element and a thermal management component, reducing the need for separate dedicated heat dissipation components
3Strength
If copper plating is applied to the heat radiation protrusion, then adhesive strength with solder is improved, but manufacturing cost increases
Solution Approach 1:
Copper plating is applied selectively only to the heat radiation protrusion areas that require solder attachment, rather than plating the entire metallic plate. This localized plating approach minimizes copper material consumption and manufacturing cost while ensuring adequate adhesive strength at critical bonding points
Solution Approach 2:
The copper plating is applied to the extent necessary for achieving reliable solder adhesion without excessive material usage. The plating thickness and coverage area are optimized to provide just sufficient adhesive strength for the solder joints, avoiding unnecessary cost increases from over-plating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat radiation and improved adhesive strength, reducing the failure rate and ensuring high thermal efficiency even when using metals other than copper, while maintaining economic properties.
Implementation Method 1
heat emitted from the heat emitting device can be directly transferred to the metallic plate
Implementation Method 2
metallic plate used for radiating heat
Implementation Method 3
the surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder
Data Source
Figure 1~6
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Figure 13~17
AI summary
Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.