Clamshell Enclosure for Liquid-Cooled Electronics

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Solution Overview

Problem

Existing liquid submersion cooling systems for electronic devices often face challenges in efficiently managing heat and protecting electronic components from ambient conditions, particularly in high-performance computing applications where signal integrity and connector exposure to liquids are concerns.

Innovation Solution

The use of a clamshell or sandwich enclosure design with a wet zone for heat-producing components and a dry zone for input/output and power connectors, employing a single-phase dielectric cooling liquid that maintains direct contact with electronic components to absorb heat without changing state, and a circulation system involving inlets, manifolds, and outlets for effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If connectors are exposed to liquid cooling systems, then heat dissipation is improved, but signal integrity degradation and reliability worsen

Engineering Contradiction:

Improveheat dissipationVSAvoidsignal integrity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The electronic device is divided into two distinct zones: a wet zone containing heat-producing components that are directly cooled by dielectric liquid, and a dry zone containing I/O connectors and power connectors that remain isolated from the liquid. This segmentation allows each zone to be optimized for its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A sealed enclosure acts as an intermediary barrier between the liquid cooling system and the electronic components. The enclosure contains the dielectric liquid in the wet zone while preventing it from contacting connectors in the dry zone, thus maintaining signal integrity while enabling effective heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If connectors are designed for liquid exposure, then cooling efficiency is improved, but connector design complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoidconnector design

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The device housing is segmented into wet and dry zones, allowing connectors to be manufactured as standard components for the dry zone without requiring specialized liquid-resistant designs, while still achieving high cooling efficiency in the wet zone where liquid contact is necessary.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Connectors are extracted from the liquid-cooled environment and placed in a separate dry zone, eliminating the need to design connectors that can withstand liquid exposure while maintaining effective cooling for the electronic components.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If electronic components are isolated from ambient conditions, then reliability is improved, but heat dissipation capability worsens

Engineering Contradiction:

Improveprotection from ambient conditionsVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The sealed enclosure serves as an intermediary that protects electronic components from ambient atmospheric conditions while incorporating a liquid cooling system inside to actively remove heat, thus simultaneously achieving both protection and effective heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The dielectric liquid creates an inert cooling environment that replaces ambient air, providing both protection from harmful atmospheric conditions and superior heat dissipation capabilities through direct liquid-to-component contact.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies connector design, reduces signal integrity degradation, and isolates circuit board electronics from ambient conditions, providing efficient heat management and reliable operation in high-performance computing environments.

Implementation Method 1

employing a single-phase dielectric cooling liquid that maintains direct contact with electronic components to absorb heat without changing state

Methodology Applied

Scientific EffectHeat absorption: Conduction (thermal)

Implementation Method 2

employing a single-phase dielectric cooling liquid that maintains direct contact with electronic components

Methodology Applied

Scientific EffectDielectric property: Dielectric

Implementation Method 3

a circulation system involving inlets, manifolds, and outlets for effective heat dissipation

Methodology Applied

Scientific EffectFluid circulation: Convection

Data Source

PatentUS20230232524A1Liquid submersion cooled electronic device with clamshell enclosure

Publication Date: 2023.07.20 LIQUIDCOOL SOLUTIONS INC

AI summary

Liquid submersion cooled electronic devices and systems are described that use one or more cooling liquids, for example one or more dielectric cooling liquids, to submersion cool individual electronic devices or an array of electronic devices. A clamshell or sandwich construction of the device housing is used to define a wet zone containing heat producing electronic components of the electronic device to be cooled by the dielectric cooling liquid, and a dry zone where input/output and power connectors are provided.