Bonding Pad Orientation for Stress Distribution

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Solution Overview

Problem

Existing electronic devices face challenges in miniaturization due to limited space for driving circuits, leading to issues such as deformation, cracking, stress concentration, and uneven pressure during bonding.

Innovation Solution

The electronic device incorporates a substrate with a bonding area and a configuration of first and second bonding pads arranged at specific angles, along with dummy pads to distribute stress evenly and prevent deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the area for driving circuit is reduced to enable miniaturization, then the device size is reduced, but the bonding circuit becomes deformed or cracked due to stress concentration

Engineering Contradiction:

Improvedevice sizeVSAvoidbonding circuit integrity

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The bonding pads are divided into two groups with different orientations (first group along first direction, second group along second direction). This segmentation allows stress to be distributed across different orientations rather than concentrated in a single direction, maintaining bonding circuit integrity while enabling device miniaturization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bonding pads are arranged asymmetrically with respect to the bonding circuit, with different groups oriented in different directions. This asymmetric arrangement prevents uniform stress concentration and reduces the risk of deformation and cracking during the bonding process.

Inventive Principle:

Principle #4Asymmetry

2Device complexity

If the bonding pads are arranged in a single direction, then the routing is simplified, but stress concentration occurs during bonding causing deformation

Engineering Contradiction:

Improverouting complexityVSAvoidbonding circuit deformation

Core Design Contradiction:

Device complexityVSShape

Solution Approach 1:

The bonding pads are arranged asymmetrically with different groups oriented in different directions relative to the bonding circuit. This asymmetric multi-directional arrangement distributes stress during bonding, preventing deformation while maintaining manageable routing complexity.

Inventive Principle:

Principle #4Asymmetry

3Ease of manufacture

If pressure is applied uniformly during bonding, then the process is simplified, but stress concentration occurs causing cracking

Engineering Contradiction:

Improvebonding process simplicityVSAvoidbonding circuit cracking resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The bonding pads are segmented into different groups with different orientations. This segmentation enables stress distribution during bonding, allowing the process to remain relatively simple while preventing cracking through the strategic arrangement of bonding pads in multiple directions.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250159805A1Electronic device

Publication Date: 2025.05.15 INNOLUX CORP

AI summary

An electronic device is provided, including a substrate, and a plurality of first bonding pads. The substrate includes a bonding area. The plurality of first bonding pads are disposed on the substrate and disposed in the bonding area. A part of the plurality of first bonding pads are arranged along a first direction, and another part of the plurality of first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.