Printed Circuit Aspects TRIZ Cases

Inorganic oxide coatings on silicon carbide fillers resolve the trade-off between heat dissipation and water absorption in printed wiring boards.

Intersecting RF strips on a ceramic substrate reduce transmission losses while maintaining compact device size.

A heatsink-less electronic unit arranges semiconductor relays and a microcomputer on a metal coreless substrate to manage thermal loads.

Dual-surface land segmentation on flexible wiring boards increases wire density for inkjet heads.

Propping portions in a circuit stack structure equalize top surface height, reducing stress concentrations and scratch damage susceptibility.

Integrated heater layers stabilize PCBA temperatures, reducing solder fatigue without affecting chamber conditions.

Masked laser ablation defines solder resist openings for bump formation, eliminating the desmear process and reducing manufacturing costs.

A two-stage etching process removes plating film and metal foil to form precise conductor patterns on wiring substrates.

Acid-modified epoxy resin composition with photopolymerizable monomers and silica filler.

Skyrmion nanotracks nucleate and move magnetic configurations via charge current to perform logic operations.

A dummy layer on cavity side walls protects contact patterns while enabling precise depth control for accurate component installation.

A laser plots negative marks on printed ink to enable optical detection of alignment between process stages.

A beveled overburden structure coats vias to reduce substrate stress during annealing, minimizing crack formation and delamination in glass-ceramic substrates.

A horizontal radar device uses a dielectric lens to convert electromagnetic waves into plane waves for directional scanning.

Alternating circuit layers on both surfaces reduce thickness, preventing connector damage while maintaining engagement strength.

A printed circuit board design uses segmented insulating layers to protect embedded patterns during manufacturing.

Curved display panels with flexible circuit board projections minimize visual discontinuity at tiled bezel seams.

Copper via seed layers adsorb plating enhancement agents to fill via holes, resolving insufficient copper filling in thin wiring substrates.

Printed copper paste with solder particles forms conductive circuit patterns on substrates.

Segmented heat dissipating patterns embedded in stacked circuit layers create multiple conduction paths to resolve heat accumulation in compact devices.

Segmented electroless and electroplating layers suppress undercut defects while maintaining mechanical robustness during fine line manufacturing.

A metal seal ring on an electrical connector prevents delamination during thermal cycling by replacing thermoplastic adhesion with stable metallic bonding.

A fan connector inserts a chip circuit board into a dedicated slot to establish stable electrical contact between conductive pads and chip terminals.

A compact electronic assembly integrates a Peltier cooling module within a thermally conductive casing to manage heat dissipation.

An inclined surface removes metal burrs from the upper substrate edge, preventing moisture permeation and signal distortion in organic light-emitting displays.

A touch sensor device structure incorporates a thin inorganic dielectric layer to form an integrated light shielding film.

A printed wiring board features a through-hole with a tapered inner diameter that guides electroplating metal to fill the cavity completely.

Substrate edge protrusions constrain wire ends during FPC cutting, preventing improper contact with metal components and avoiding short circuits.

Electroplating fills through-holes while etching removes surface metal, eliminating thick land plating that reduces flexibility.

Adhesion promoting material layers prevent abnormal interface penetration during electroless plating to eliminate short circuits.

Angled bonding pads distribute stress to prevent deformation and cracking during electronic device miniaturization.

A thermosetting resin composition uses a high pH dispersant to stabilize boron nitride dispersion within the polymer matrix.

A multilayer printed circuit board power converter module uses asymmetric copper layer distribution to increase wiring area.

A via hole inductor structure utilizes parasitic inductance to create adjustable magnetic components within a circuit board.

A planar terminal extends to the base edge to form a solder pool that collects molten solder and maintains electrical continuity.

A flexible substrate with a curled electrical connection unit positions capacitance sensing circuits adjacent to organic electroluminescent panels.

Tin electroplating liquid with alpha,beta-unsaturated aldehyde additives prevents voids and burns during via filling.

A guide member surrounds the substrate periphery to orient press-fit terminals during insertion.

A flexible wiring board uses an arc-shaped folded portion in its characteristic impedance control circuit to reduce local impedance mismatching.

Integrating a capacitance monitoring chip with internal electrodes enables real-time vibration detection, preventing overload damage from amplitude deviations.

A circuit board uses elevated copper bridging bars to dissipate heat from power components.

Electrically conductive reinforcement fibers transmit signals through a polymer matrix to replace bulky wire harnesses.

A flexible polymeric dielectric substrate integrates thermally conductive conduits to manage heat from light emitting semiconductor devices.

Dual diameter edge trimming isolates via segments, eliminating stub effects that distort high-speed signals.

A movable fit engaging mechanism slides along a fixed base to secure objects through elastic reciprocating motion.

Silane coupling agents bridge boron nitride fillers and the resin matrix, resolving thermal conductivity versus moisture absorption trade-offs.

Metal soap release agent prevents layer adhesion during pressing, eliminating complex film registration.

A heat dissipation structure uses concave-convex surfaces to increase contact area between a metal component and a heat sink.

A white inorganic insulating layer dissipates heat and reflects light using a coated mixture of silicon dioxide nanoparticles.