Inkjet Head Wiring Board Dual-Surface Land Segmentation
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Solution Overview
Problem
The existing connection structure of flexible wiring boards in inkjet heads limits the number of wires that can be provided within a predetermined area, leading to potential issues with supplying drive current and increasing the risk of short circuits when trying to increase the number of ink ejection outlets, which restricts the ability to perform high-quality printing and reduces the size of the inkjet printer.
Innovation Solution
The solution involves providing wires on both surfaces of the flexible wiring board, with electrically conductive brazing filler metals connecting the piezoelectric element and land sections, and using a thinner connection section to prevent the melted solder from spreading excessively, allowing for a secure connection and increased wire density without enlarging the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If wires are provided on both surfaces of the flexible wiring board to increase wire area, then the number of wires that can be provided increases, but the melted solder flows and spreads over the wire, reducing the thickness and connection strength
Solution Approach 1:
The patent divides the wiring board into multiple surfaces (first surface and second surface) and segments the wire arrangement accordingly. Wires are provided on both surfaces separately, with land sections positioned at different locations on each surface. This segmentation allows increased wire capacity while maintaining connection reliability by preventing solder from spreading across the entire wire length.
Solution Approach 2:
The patent transitions from a single-surface wire arrangement to a multi-surface arrangement. By utilizing the third dimension (z-axis) to place land sections and wires on opposite surfaces of the flexible wiring board, the design increases wire density without compromising connection strength, as solder deposited on one surface does not spread to wires on the other surface.
2Quantity of substance
If the number of wires is increased to support more ink ejection outlets, then the drive current capacity increases, but the flexible wiring board size must be enlarged
Solution Approach 1:
The patent utilizes both surfaces of the flexible wiring board to arrange wires, effectively doubling the wire capacity within the same board area. This multi-surface arrangement allows a higher number of ink ejection outlets to be supported without enlarging the overall board size, as wires are distributed across the first and second surfaces.
Solution Approach 2:
The patent combines wire arrangements on both surfaces of the flexible wiring board into a unified design. By merging the functionality of single-surface layouts with dual-surface implementation, the system achieves increased wire density and drive current capacity while maintaining compact board dimensions.
3Area of moving object
If land sections are provided on the same surface as ground wires, then wire area is maximized, but short circuit risk increases due to solder leakage
Solution Approach 1:
The patent segments the functional areas by placing land sections for signal wires on one surface and ground wires on the opposite surface. This spatial segmentation prevents solder from ground wires from reaching signal wire land sections, eliminating short circuit risk while preserving maximum wire area utilization across both surfaces.
Solution Approach 2:
The flexible wiring board itself acts as an intermediary barrier between ground wires and signal wire land sections. By positioning these conductive elements on opposite surfaces with the insulating board material between them, the design prevents harmful electrical interaction while maintaining efficient wire routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a secure connection of the wiring board to the piezoelectric element, allows for a higher number of ink ejection outlets, and reduces the size of the inkjet head, facilitating high-quality printing while minimizing the risk of short circuits and defects.
Implementation Method 1
an inkjet head that ejects an ink from a plurality of ejection outlets by pressure generated by a piezoelectric element when a drive element drives the piezoelectric element
Implementation Method 2
electrically conductive brazing filler metals connecting the terminal sections of the piezoelectric element and the land sections of the wiring board
Data Source
AI summary
A plurality of land sections, each enclosed by two slits, are formed in a ground wire provided on a side of a flexible wiring board to which a piezoelectric element is connected. Since the ground wire and the land sections are connected by only a thin connection section, the solder deposited on the land sections does not flow to the ground wire.