Anti-adhesion Material for PCB Partial Area Removal
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Solution Overview
Problem
Existing methods for producing multi-layer printed circuit boards face challenges in efficiently removing partial areas after connection, as they require complex pre-assembly of adhesive or separating films, leading to high effort and registration demands, and the use of wax-like pastes for adhesion prevention results in difficulty in removing the partial area and subsequent structuring.
Innovation Solution
A method utilizing an anti-adhesion material containing metal soaps, binders, and solvents, applied via printing processes, which allows for easy and reliable application and removal of partial areas, ensuring optimal release and structuring during the production of multi-layer printed circuit boards, even under elevated temperature and pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If pre-assembly of adhesive films or separating films is used to enable subsequent removal of partial areas, then the removal of partial areas becomes possible, but the device complexity and manufacturing effort increase significantly due to high registration demands
Solution Approach 1:
The patent extracts the adhesion prevention function from complex pre-assembled films and separates it into a standalone anti-adhesion material layer. This layer can be applied independently to specific areas where removal is desired, eliminating the need for complex pre-assembly of multiple films and reducing registration demands while enabling partial area removal.
Solution Approach 2:
The patent segments the anti-adhesion function into a separate, independently applicable material layer rather than requiring integrated pre-assembly of adhesive and separating films. This segmentation allows the anti-adhesion material to be applied only to specific areas where removal is needed, simplifying the overall process and reducing complexity.
2Object-generated harmful factors
If wax-like paste is used as adhesion-preventing material, then adhesion prevention during pressing is achieved, but the material cannot be easily removed after partial area removal and subsequent structuring is hindered
Solution Approach 1:
The patent changes the chemical and physical parameters of the adhesion-preventing material from wax-like paste to a composition based on metal soaps, binders, and solvents. This parameter change allows the material to provide effective adhesion prevention during pressing while enabling easy removal afterward through dissolution in solvents, thus facilitating subsequent structuring operations.
Solution Approach 2:
The patent designs the anti-adhesion material to be easily discarded (removed) after serving its purpose during pressing. The material can be dissolved and removed using solvents, allowing the surface to be recovered for subsequent structuring and processing operations without hindrance from residual adhesion-preventing material.
3Ease of operation
If complex pre-assembly methods are used to enable partial area removal, then removal capability is achieved, but productivity decreases due to high effort and time consumption
Solution Approach 1:
The patent applies the anti-adhesion material in advance to specific areas where removal is desired, but in a simplified manner that does not require complex pre-assembly. The material is applied directly to the substrate or layer, and its preliminary placement enables subsequent easy removal without the time-consuming and effort-intensive pre-assembly processes of prior art.
4Object-generated harmful factors
If adhesion-preventing material is applied during pressing under elevated temperature and pressure, then adhesion prevention is achieved, but the material may leak or fail to maintain structural integrity
Solution Approach 1:
The patent uses a composite material composition consisting of metal soaps, binders, and solvents. This composite formulation provides the necessary stability to withstand elevated temperature and pressure during pressing without leaking, while the metal soap component maintains adhesion prevention functionality. The binder holds the structure together under stress, preventing material failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables reliable and efficient removal of partial areas, maintaining structural integrity and allowing for further processing, while reducing the complexity and effort in the production process, and improving the miniaturization and registration accuracy of multi-layer printed circuit boards.
Implementation Method 1
the material that prevents adhesion contains at least one metal soap in addition to a binder and a solvent as a release agent
Implementation Method 2
a wax-like paste being used as an adhesion-preventing material, such a wax-like paste being applied after application during a subsequent pressing
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.