Flexible Substrate Curled Electrical Connection for Organic EL Touch Sensing
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Solution Overview
Problem
Traditional organic electroluminescent modules with integrated capacitance sensing circuits face challenges in achieving high accuracy touch sensing due to the placement of the sensing circuit on the opposite side of the light-emitting side, which hinders capacitance detection and increases manufacturing complexity.
Innovation Solution
The organic electroluminescent module features a flexible substrate with a curled electrical connection unit, where the capacitance sensing circuit is on one surface and drive circuits on another, with lands and metal layers on the contact piece, allowing the organic electroluminescent panel to be mounted without bending, enhancing touch sensing accuracy and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the capacitance sensing circuit is integrated in the FPC on the opposite side to the light-emitting side, then the FPC can be electrically connected to the organic EL panel, but the sensing circuit is hindered from detecting capacitance variations and touch sensing accuracy decreases
Solution Approach 1:
The patent transitions the sensing circuit from a two-dimensional planar arrangement on the FPC to a three-dimensional configuration where the FPC is folded back. This spatial repositioning places the sensing circuit directly adjacent to the organic EL panel's touch surface, eliminating the distance barrier that previously hindered capacitance detection while maintaining electrical connection functionality.
Solution Approach 2:
Instead of placing the sensing circuit on the conventional side of the FPC (opposite to the display), the patent inverts the FPC structure by folding it back. This inversion repositions the sensing circuit to the correct side for touch sensing, allowing it to function properly while still maintaining electrical connection to the panel through the folded FPC structure.
2Measurement precision
If the FPC is folded back to place the sensing circuit adjacent to the organic EL panel, then touch sensing accuracy is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the FPC into functionally distinct regions: a first portion for electrical connection and a second portion (sensing circuit area) for touch sensing. This segmentation allows each portion to be optimized for its specific function and simplifies the folding process by creating a clear hinge point between the two portions, making the manufacturing process more manageable despite the added complexity.
Solution Approach 2:
The FPC is pre-configured with the sensing circuit on its second portion before assembly with the organic EL panel. This preliminary arrangement of the sensing circuit in its final operational position simplifies the overall manufacturing process by eliminating the need for complex post-assembly routing or repositioning of sensitive components.
3Device complexity
If the organic EL panel is mounted on a traditional FPC configuration, then the structure is simple, but the panel requires bending which increases manufacturing steps
Solution Approach 1:
The patent introduces a dynamic, flexible configuration to the FPC by folding it back, transforming it from a rigid planar structure to a three-dimensional adaptive structure. This dynamic arrangement allows the sensing circuit to reach its optimal position adjacent to the panel without requiring the panel itself to be bent, thereby simplifying panel assembly while maintaining structural flexibility.
Data Source
AI summary
An organic electroluminescent module of the present invention includes an organic EL panel and an electrical connection unit. The electrical connection unit includes a flexible substrate including a body disposed adjacent to a light-emitting surface of the organic EL panel, and a contact piece defined by a cutout in the body and disposed remote from the light-emitting surface of the organic EL panel; a capacitance sensing circuit and drive circuits formed on a surface of the body; lands formed on a surface of the contact piece; and metal layers formed on a surface of the contact piece in portions overlapping with the lands.