Circuit Stack Propping Portions Scratch Resistance
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Solution Overview
Problem
The existing circuit stack structure in active component array substrates is prone to damage from scratches due to differences in height and contact area between convex and concave portions in the transition line area, leading to increased risk of wiring damage and higher manufacturing and maintenance costs.
Innovation Solution
The introduction of a circuit stack structure with alternating first and second areas, where first propping portions are used to equalize the top surface height and reduce friction differences, and the incorporation of second metal wires with through openings to align with first metal wires, reducing contact area and friction forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional circuit stack structure with gaps between metal wires is used, then the wiring can be formed on the substrate, but the convex and concave portions created in the protective layer lead to stress concentration and increased susceptibility to scratch damage
Solution Approach 1:
The patent introduces propping portions specifically in the gap regions between metal wires, creating localized structural support only where needed. This local modification fills the concave portions in the protective layer, eliminating stress concentration points without altering the overall wiring structure or metal wire configurations.
Solution Approach 2:
The propping portions are formed in advance during the manufacturing process, before the protective layer is applied. By pre-positioning these support structures, the patent ensures that when the protective layer is deposited, the surface remains substantially flat, preventing subsequent scratch damage and stress concentration issues.
2Reliability
If gaps are maintained between adjacent metal wires for circuit functionality, then electrical isolation is achieved, but uneven surfaces are created in the protective layer leading to friction differences and damage risks
Solution Approach 1:
The propping portions are selectively placed only in the gap regions between metal wires, maintaining the necessary electrical isolation while locally compensating for the surface unevenness. This targeted approach preserves the functional gaps while achieving surface uniformity for the protective layer.
Solution Approach 2:
The propping portions act as intermediary structures that bridge the gap regions, providing mechanical support and surface leveling without interfering with the electrical function of the metal wires. These intermediary elements mediate between the conflicting requirements of maintaining gaps for electrical isolation and achieving uniform surfaces for protection.
Data Source
AI summary
A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions are electrically isolated with the metal wires. With supporting by the propping portions, all regions of a top surface of the protective layer corresponding to one of the propping portions are coplanar with all regions of the top surface of the protective layer corresponding to each of the metal wires.