Electronic Assembly Thermal Management with Peltier Cooling
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Solution Overview
Problem
Existing cooling solutions for telematics control units in vehicles are structurally complex, voluminous, and inefficient, leading to potential safety risks due to temperature fluctuations on the vehicle roof.
Innovation Solution
A compact electronic assembly with a thermally conductive casing, a Peltier cooler, and thermal coupling mechanisms, including a housing with fingers and a metal ground plane, to enhance heat dissipation and protect against mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing cooling solutions are used for telematics control units, then cooling function is provided, but structural complexity increases and volume increases and efficiency decreases
Solution Approach 1:
The patent merges the cooling module with the housing structure by integrating the heat dissipation fins directly into the housing walls. The housing serves dual purposes: mechanical protection and thermal management. This integration eliminates separate cooling components and reduces overall structural complexity while maintaining effective heat dissipation.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: it provides mechanical enclosure, structural support, and active heat dissipation through integrated fins. The thermally conductive material used in the housing serves both structural and thermal management purposes, reducing the need for additional specialized components.
2Temperature
If existing cooling solutions are used for telematics control units, then cooling function is provided, but volume increases
Solution Approach 1:
By combining the housing and cooling module into a single integrated structure, the patent eliminates the volume occupied by separate cooling components. The heat dissipation fins are formed as part of the housing walls themselves, maximizing space utilization and minimizing overall assembly volume.
Solution Approach 2:
The patent utilizes the vertical dimension by extending heat dissipation fins outward from the housing walls. This three-dimensional heat dissipation approach allows efficient thermal management without increasing the horizontal footprint of the assembly, effectively using available space in the vertical direction.
3Productivity
If existing cooling solutions are used for telematics control units, then cooling function is provided, but efficiency decreases
Solution Approach 1:
The patent applies thermal management resources locally where heat generation occurs. The cooling module is positioned in direct thermal contact with the electronic module, and heat dissipation fins are strategically placed on housing walls adjacent to heat-generating components. This localized approach maximizes cooling efficiency without requiring complex system-wide thermal management.
Solution Approach 2:
The patent introduces thermal paste as an intermediary substance between the cooling module and electronic module to enhance thermal contact. This simple additive significantly improves heat transfer efficiency without adding mechanical complexity, bridging the thermal gap between components.
4Reliability
If the cooling module is not restrained, then mechanical stress affects the cooling module, but adding restraint structures increases complexity
Solution Approach 1:
The patent merges the restraint function with the housing structure by incorporating positioning features directly into the housing. The housing walls and integrated fins serve dual purposes: thermal management and mechanical restraint of the cooling module. This eliminates the need for separate restraint mechanisms while providing reliable mechanical protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat dissipation, reduces mechanical stress on the cooling module, and ensures safe operation of telematics control units by maintaining optimal temperatures despite extreme roof temperatures.
Implementation Method 1
a casing (3) having a thermally conductive wall (9)
Implementation Method 2
a cooling module (8) placed in the housing (7) so as to be thermally coupled to both the thermally conductive wall (9) and the electronic module (2)
Data Source
AI summary
The invention relates to an electronic assembly (1) comprising a printed circuit board (4), an electronic module (2) fixed on a first side (5) of the printed circuit board (4), a casing (3) having a thermally conductive wall (9), fastening means (18) configured to keep the printed circuit board (4) at a distance from the thermally conductive wall (9) inside the casing (3), a housing (7) extending from an inner side (19) of the thermally conductive wall (9), and a cooling module (8) placed in the housing (7) so as to be thermally coupled to both the thermally conductive wall (9) and the electronic module (2), the housing (7) being configured to restrain the movements of the cooling module (8) in any direction parallel to the thermally conductive wall (9).