Concave-Convex Heat Dissipation Structure for Circuit Boards
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Solution Overview
Problem
Conventional heat dissipation structures for circuit boards face inefficiencies due to limited contact areas between thermal interface materials and both the circuit board and heat sink, leading to suboptimal heat dissipation performance.
Innovation Solution
A heat dissipation structure utilizing a concave-convex three-dimensional configuration between a metal component and a heat sink, combined with a heat dissipation medium, to increase contact areas and enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is positioned on the opposite side of the circuit board to utilize thermal interface material for heat transfer, then heat dissipation can be achieved, but the contact area between the thermal interface material and the circuit board becomes insufficient due to limited circuit board area and component layout constraints
Solution Approach 1:
The patent transitions from a two-dimensional planar contact interface to a three-dimensional concave-convex contact structure. The first concave-convex surface on the metal component and the corresponding second concave-convex surface on the heat sink create multiple contact points and increased surface area for thermal interface material adhesion, effectively solving the limited contact area problem on the circuit board.
2Temperature
If a heat sink is positioned on the opposite side of the circuit board to utilize thermal interface material for heat transfer, then heat dissipation can be achieved, but the contact area between the thermal interface material and the heat sink becomes insufficient
Solution Approach 1:
The patent employs a three-dimensional concave-convex contact structure where the heat sink features a second concave-convex surface that corresponds to the first concave-convex surface on the metal component. This dimensional transformation from flat to textured surfaces significantly increases the contact area available for thermal interface material, improving heat transfer efficiency.
3Temperature
If a conventional flat heat dissipation structure is used, then the structure is simple to manufacture, but the heat dissipation performance is suboptimal due to insufficient contact area
Solution Approach 1:
The patent introduces concave-convex surfaces on both the metal component and heat sink, transforming the traditional flat interface into a three-dimensional textured structure. This dimensional enhancement increases contact area and improves heat dissipation performance while maintaining compatibility with conventional manufacturing processes through standard machining or molding techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure significantly increases contact areas between the heat dissipation medium and both the metal component and heat sink, thereby reducing thermal resistance and improving heat dissipation efficiency.
Implementation Method 1
transferring heat from the surface of an internal heat component to a heat sink through a thermal interface material (TIM) via thermal conduction
Data Source
AI summary
A heat dissipation structure including a circuit board, a heat component, a metal component, a heat dissipation medium, and a heat sink is proposed. The heat component is connected to one side of the circuit board. The metal component is connected to another side of the circuit board and has a first concave-convex surface. The heat dissipation medium is connected to the metal component. The heat sink is connected to the heat dissipation medium and has a second concave-convex surface. The heat component, the circuit board, the metal component, the heat dissipation medium, and the heat sink are connected in sequence. The shape of the first concave-convex surface corresponds to the shape of the second concave-convex surface. One side of the heat dissipation medium is connected to the first concave-convex surface, and another side of the heat dissipation medium is connected to the second concave-convex surface.