Component Carrier Metal Foil Electroplating for Fine Line Precision
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Solution Overview
Problem
The increasing miniaturization and complexity of component carriers with multiple electronic components pose challenges in forming reliable and precise electrically conductive structures, particularly in heat dissipation and mechanical robustness, while maintaining electrical reliability under harsh conditions.
Innovation Solution
A component carrier is manufactured using a dielectric layer structure covered by a metal foil, with an electroless metal layer and a multi-stage electroplating structure, allowing for the creation of electrically conductive traces with high precision and reliability, enabling fine line/space ratios of up to 20 µm/20 µm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If miniaturization of electronic components and increasing component density are implemented, then product functionality and integration are improved, but heat dissipation becomes increasingly difficult and manufacturing precision requirements worsen
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: electroless plating to form an initial metal layer, followed by electroplating to build up the final trace structure. This segmentation allows each process to be optimized independently, achieving the required fine line/space ratios of 20 µm/20 µm through controlled deposition rather than relying solely on lithographic precision.
Solution Approach 2:
The patent transitions from planar 2D trace formation to 3D controlled deposition by building metal traces vertically through electroless and electroplating processes. This dimensional approach enables precise control of trace thickness and width, achieving fine line/space ratios while maintaining manufacturing feasibility.
2Manufacturing precision
If fine line/space ratios of 20 µm/20 µm are achieved through electroless and electroplating processes, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The manufacturing process is divided into sequential stages: first electroless plating to create a uniform base metal layer, then electroplating in controlled stages to build up the final trace structure. Each stage serves a specific function, simplifying the overall process control while achieving high precision.
Solution Approach 2:
The electroless plating process performs preliminary action by creating a uniform metal base layer before electroplating begins. This preliminary metal layer serves as a foundation that ensures even electroplating deposition, reducing process complexity and improving final trace uniformity.
3Manufacturing precision
If metal foil thickness is reduced to enable fine line/space ratios, then manufacturing precision is improved, but mechanical robustness deteriorates
Solution Approach 1:
The metal structure is segmented into multiple deposited layers (electroless metal layer plus electroplated layers) rather than using a single thick foil. This layered structure achieves the required fine line/space ratios while the cumulative thickness and layered architecture maintain mechanical robustness.
Solution Approach 2:
The patent creates a composite metal structure combining electroless metal layer and electroplated layers, each with different deposition characteristics. This composite approach optimizes both precision (through controlled thin layer deposition) and strength (through cumulative thickness and layered bonding).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of component carriers with excellent electrical reliability and reproducibility, suppressing undercut issues and allowing for high-frequency signal transmission with low loss, while maintaining mechanical robustness and facilitating further miniaturization.
Implementation Method 1
forming an electroless metal layer on the metal foil
Implementation Method 2
forming a multi-stage electroplating structure on the electroless metal layer
Data Source
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AI summary
The present application provides a method of manufacturing a component carrier and a component carrier, wherein the method comprises covering a dielectric layer structure (102) by a metal foil (104), forming an electroless metal layer (108) on the metal foil (104), and forming a multi-stage electroplating structure (110) on the electroless metal layer (108).