White Inorganic Insulating Layer for LED Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor devices with organic insulating layers face challenges in heat dissipation and durability, leading to reduced emission efficiency in LED devices, and are costly due to the use of expensive materials like silver plating.
Innovation Solution
A semiconductor device with a white inorganic insulating layer formed by coating a mixture of silicon dioxide nanoparticles and white inorganic pigment, which provides superior heat resistance and durability, and can be manufactured using inkjet or spray coating methods, eliminating the need for expensive reflecting materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic insulating layer is used in semiconductor devices, then ease of manufacture is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent applies composite materials by creating an inorganic insulating layer composed of inorganic particles (such as aluminum oxide, aluminum nitride, or silicon oxide) dispersed in an organic resin matrix. This composite structure combines the ease of manufacture of organic materials with the superior heat dissipation properties of inorganic materials, achieving both manufacturability and thermal performance.
2Illumination intensity
If silver plating is used as reflecting material, then reflectance is improved, but material cost deteriorates
Solution Approach 1:
The patent replaces expensive silver plating with a cost-effective inorganic insulating layer that provides sufficient reflecting properties. This layer is formed through conventional coating and firing processes, eliminating the need for expensive precious metals while maintaining the necessary optical performance for LED applications.
3Loss of energy
If ceramic or silicon substrates are used, then heat dissipation is improved, but processing difficulty deteriorates
Solution Approach 1:
The patent changes the material parameters by using an inorganic insulating layer with controlled particle size distribution, inorganic content (50-90 wt%), and firing conditions. This allows optimization of both heat dissipation performance and processing ease, avoiding the difficulties associated with ceramic and silicon substrate processing while maintaining superior thermal conductivity.
4Reliability
If inorganic insulating layer with high inorganic content is used, then heat resistance and durability are improved, but manufacturing complexity deteriorates
Solution Approach 1:
The patent applies local quality by concentrating inorganic particles specifically in the insulating layer where thermal performance is critical, while maintaining a manageable overall structure. The inorganic particles are distributed within the organic resin matrix, providing localized heat resistance and durability enhancement without requiring complete structural redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves enhanced heat dissipation and durability while reducing material costs by using a high-content inorganic insulating layer that functions as both an insulator and reflector, improving the thermal conductivity and longevity of LED devices.
Implementation Method 1
a white inorganic insulating layer that functions as a reflecting material
Implementation Method 2
superior in heat resistance, heat dissipation, and durability
Data Source
Figure 1~2
Figure 3(a)~3(d)
Figure 4(a)~4(c)
AI summary
[Object] A semiconductor device is provided which includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. [Solution] In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material. Preferably, a rate of SiO2 and the white insulating layer contained in the white insulating layer after the baking is 80 % by weight or greater.