PCB Post Contact and Insulating Layer Segmentation
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Solution Overview
Problem
The challenge in forming fine circuits on printed circuit boards with posts is that existing structures face difficulties in accurately positioning and protecting the embedded patterns and pads, leading to potential damage during manufacturing processes.
Innovation Solution
The proposed solution involves a printed circuit board design with a first insulating layer, an embedded pattern, a pad, and a post where the center of the post's side surface is in contact with the insulating layer, along with a second insulating layer and an intermediate metal layer to protect the embedded pattern and pad during etching, ensuring the fine circuit's integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If posts are added to reduce bump pitch, then productivity is improved, but manufacturing precision deteriorates due to difficulty in forming fine circuits between posts
Solution Approach 1:
The patent divides the insulating layer into multiple segments: a first insulating layer forming the base structure, and a second insulating layer formed later to cover and protect the embedded patterns and pads. This segmentation allows the fine circuits to be formed and protected in distinct stages, resolving the contradiction between reducing bump pitch and maintaining fine circuit formation precision.
Solution Approach 2:
The embedded patterns and pads are formed and embedded into the first insulating layer before the second insulating layer is applied. This preliminary action ensures that the fine circuits are established in advance, allowing subsequent protective measures to be taken without compromising their formation precision.
2Ease of manufacture
If embedded patterns and pads are exposed during etching, then ease of manufacture is improved, but reliability deteriorates due to potential damage to fine circuits
Solution Approach 1:
The second insulating layer serves as an intermediary protective barrier between the etching process and the embedded patterns/pads. It allows the etching to proceed easily while preventing direct exposure and potential damage to the fine circuits, thus maintaining both ease of manufacture and circuit reliability.
Solution Approach 2:
The second insulating layer is formed beforehand to cover and protect the embedded patterns and pads before the etching process begins. This prior cushioning ensures that the fine circuits are shielded from potential damage during manufacturing, maintaining reliability while allowing easy etching of other structures.
3Area of stationary object
If posts are used to reduce pitch, then area is reduced, but device complexity increases due to additional structural elements
Solution Approach 1:
The patent merges the protective function with the insulating function by making the second insulating layer serve both purposes: it provides electrical insulation and simultaneously protects the embedded patterns and pads. This merging reduces the need for separate protective structures, thereby reducing device complexity while maintaining the area reduction benefits of using posts.
Data Source
AI summary
A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.