Bonding Point Line Width Variation for Flexible Substrate Accuracy
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Solution Overview
Problem
The increasing common difference in the bonding area of ultra-thin flexible substrates poses a challenge for existing touch panel designs, which require a sufficient design space that is difficult to maintain with equal line width and spacing.
Innovation Solution
The design incorporates a substrate and flexible printed circuit board with pins of varying line widths and spacings, forming central, first, and second bonding points arranged in an arithmetic distribution, with specific line width differences and spacings to optimize bonding accuracy and reduce the bonding area length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If equal line width and equal line spacing are used in bonding area design, then design simplicity is maintained, but bonding accuracy deteriorates due to increasing common difference in ultra-thin flexible substrates
Solution Approach 1:
The patent applies local quality by differentiating the line widths of bonding points based on their location. Central bonding points have a first line width, while first bonding points have a second line width that is larger than the first. This local differentiation compensates for the increasing common difference in ultra-thin flexible substrates, maintaining bonding accuracy across the entire bonding area without requiring complex overall design changes.
2Adaptability or versatility
If sufficient design space is allocated for equal line width and spacing, then manufacturing flexibility is improved, but bonding area length increases which is incompatible with ultra-thin flexible substrate technology
Solution Approach 1:
The patent changes the parameter of line width based on the position of bonding points. By setting different line widths for central and first bonding points, the design achieves sufficient design space for manufacturing flexibility without increasing the overall bonding area length. This parameter differentiation allows the bonding area to accommodate ultra-thin flexible substrate requirements while maintaining adequate design space.
Data Source
AI summary
An electronic device includes a substrate and a flexible printed circuit board. The substrate includes a plurality of first pins disposed on the substrate. The flexible printed circuit board includes a plurality of second pins disposed on the flexible printed circuit board. The first pins and the second pins are bonded to each other to form a plurality of bonding points. The bonding points include at least one central bonding point and at least one first bonding point. The at least one central bonding point is located in a central area of the electronic device. The at least one first bonding point is located in a first area of the electronic device. The first area is located outside the central area. A line width of the at least one first bonding point is greater than a line width of the at least one central bonding point.