Printed Circuit Aspects TRIZ Cases

A multifunction fingerprint sensor integrates live finger detection to verify biometric authenticity.

A film wiring substrate uses concave-convex step portions on conductive regions to prevent folding along the disposed direction of wiring patterns.

A semiconductor memory device mounts a controller and connector on an identical substrate surface to enable high-speed data transfer.

A heat radiation layer on a printed circuit board with through-holes transfers thermal energy from an image sensor.

A thermosetting resin composition uses a star-shaped styrene-butadiene-styrene triblock copolymer to form a homogeneous crosslinking network.

A motherboard integrates resistance elements on power traces to detect current values for consumed power calculation.

A reflection layer redirects ultraviolet light to cure adhesive in display pad areas, preventing air gaps and dust infiltration.

Segmented wiring conductors fill insulation layer grooves using underlying metal and electrolytic plating layers to create robust electrical paths.

Stacking connectors link modular boards to enable plug-and-play expansion of heterogeneous IoT networks.

Segmenting the display panel into flat and bending regions resolves alignment precision trade-offs while minimizing bezel size.

A platable dielectric layer with a trench pattern guides chemical plating to form conductive patterns on circuit boards.

A flexure overlaying connection terminals with a thin metal plate and protective insulating layer to reinforce mechanical strength.

Asymmetric guiding portions enable multi-directional wire insertion while maintaining compact board space and reliable holding.

A quick mounting junction box integrates a circuit board with power and motor connectors to simplify assembly.

A metal heat dissipation member connects directly to a chip and the printed circuit board protection cover.

Universal capacitor subassemblies support various SSD form factors, reducing design time and inventory complexity.

Segmenting heater and LED circuits on one substrate eliminates separate components, reducing weight while maintaining high brightness at elevated temperatures.

Single-layer flexible circuit board positions touch and display signal lines on opposite sides, eliminating interference while reducing thickness and cost.

Segmented insulation layers eliminate reinforcement projections in via holes, preventing voids and ensuring uniform metal adhesion for stable connections.

A printed circuit board for brushless DC motors features sensor wings bent perpendicularly from the main substrate to mount Hall sensors via surface-mount technology.

A thermosetting resin prepreg uses specific inorganic filler ratios to improve thermal conductivity and heat resistance.

Stiffeners bonded with thermoplastic film suppress warping in coreless wiring boards by matching thermal expansion coefficients.

A thermally insulating dielectric layer within a printed circuit board isolates electrical components on opposite sides.

Segmented electroplating with a masking film prevents voids and reduces metal usage in wiring board production.

Parylene dielectric films isolate multiple conductors within single via holes to maintain high voltage barriers and interconnect reliability.

Sacrificial sections on flexible circuits enable precise module attachment without occupying module surface real estate.

Selective via filling and organic solderability preservative coating eliminate solder wicking defects while enhancing heat transfer efficiency.

Segmenting the annular core allows busbar insertion before joining, while magnetic adhesive restrains movement to prevent coating damage during assembly.

A via secondary hole pools solder to enhance mechanical bond strength, resolving coplanarity issues and limited solder application space in densely packed PCBs.

Segmented imaging modules enable independent replacement to resolve maintenance complexity and reduce downtime in multi-window scanning systems.

A display device integrates a vertically oriented LED module with a light guide plate to reduce overall thickness while maintaining uniform illumination.

Dual grain size via filling prevents voids and dimples while enhancing heat dissipation without additional etching.

A vertical bridge printed circuit board routes high-speed signals across multiple device areas without increasing the main board layer count.

A display apparatus integrates a heat sink plate and guide panel to manage thermal loads.

Alternating copper and nickel layers on glass substrates balance mechanical stress to eliminate warpage during manufacturing.

Segmenting the carrier into dedicated power and control zones resolves heat dissipation bottlenecks while maintaining structural simplicity.

Vertical conductive traces in substrate recesses boost inductance, solving passive RFID power delivery limits.

Segmented magnet structures reduce field amplitude to prevent Hall chip saturation, enabling accurate signal generation across varying air gaps.