Image Sensor Package Thermal Management via PCB Through-Holes
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Solution Overview
Problem
Camera devices face challenges in miniaturization due to the thickness of components like printed circuit boards, image sensors, and infrared filters, and require improved heat radiation to manage increasing power consumption and heat generation with high-resolution and high-speed video frame rates.
Innovation Solution
The implementation of an image sensor package with a printed circuit board featuring a heat radiation layer, through-holes for enhanced thermal conductivity, and a metal oxide insulating substrate, along with a thermal interface material, to efficiently radiate heat and reduce overall device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the total thickness from the printed circuit board to the IR filter is reduced for miniaturization, then the device size is reduced, but the heat radiation performance deteriorates
Solution Approach 1:
The printed circuit board is designed with through-holes that pass through from the first surface to the second surface, creating a porous structure that enables heat to be radiated efficiently through the board thickness, resolving the contradiction between reduced device size and maintained heat radiation performance
Solution Approach 2:
The heat radiation layer is formed as a composite structure including an insulating substrate with metal oxide (90 wt% or more), metal layers, and thermal interface materials, combining materials with different thermal and electrical properties to achieve superior heat radiation while maintaining compact dimensions
2Productivity
If high-resolution and high-speed video frame rates are implemented, then imaging performance is improved, but power consumption and heat generation increase
Solution Approach 1:
The patent converts the harmful heat generated by high-power imaging operations into a manageable thermal flow by designing dedicated heat radiation pathways through the printed circuit board, transforming the waste heat into a controlled thermal management system that enables sustained high-performance operation
3Reliability
If the image sensor and printed circuit board are wire-bonded with conventional spacing, then electrical connection is achieved, but the overall thickness increases
Solution Approach 1:
The patent merges the electrical connection function and heat radiation function into a unified structure where the same printed circuit board and through-holes serve both purposes, eliminating the need for separate heat dissipation components and reducing overall device thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact camera device with superior heat radiation performance, supporting high-performance imaging while minimizing size and manufacturing complexity.
Implementation Method 1
heat radiation layer disposed on a first surface of the printed circuit board... efficiently radiating heat
Implementation Method 2
a plurality of through-holes passing through the printed circuit board... in contact with the heat radiation layer
Implementation Method 3
a thermal interface material disposed between the insulating substrate and the image sensor
Data Source
AI summary
A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.