Modular Capacitor Subassembly for SSD Backup Power
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Solution Overview
Problem
Conventional electronic devices face challenges in efficiently utilizing capacitors for backup power across different form factors, leading to increased design time, higher inventory costs, and reduced board space.
Innovation Solution
A modular capacitor subassembly is introduced, allowing the same SSD main board to be used in multiple devices with different form factors by utilizing a modular capacitor daughter board with adjustable capacitor thickness and capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional capacitors are used for backup power in SSD devices, then the capacitors can provide power loss protection, but the design time increases and inventory costs increase due to the need to support multiple form factors
Solution Approach 1:
The patent implements a universal capacitor subassembly design that can be used across multiple SSD form factors (2.5-inch, 3.5-inch, and smaller form factors). The subassembly includes a capacitor, holder, and pre-compression mechanism that maintains consistent electrical and mechanical connections regardless of the SSD form factor, eliminating the need for form-factor-specific capacitor designs and reducing design time and inventory complexity
2Reliability
If conventional capacitors are used for backup power in SSD devices, then the capacitors can provide power loss protection, but the inventory costs increase due to the need to support multiple form factors
Solution Approach 1:
The patent implements a universal capacitor subassembly design that can be used across multiple SSD form factors (2.5-inch, 3.5-inch, and smaller form factors). The subassembly includes a capacitor, holder, and pre-compression mechanism that maintains consistent electrical and mechanical connections regardless of the SSD form factor, eliminating the need for form-factor-specific capacitor designs and reducing design time and inventory complexity
3Reliability
If conventional capacitors are used for backup power in SSD devices, then the capacitors can provide power loss protection, but the board space increases due to the need to accommodate different capacitor sizes
Solution Approach 1:
The patent employs a pre-compression mechanism that applies consistent compressive force to the capacitor regardless of its specific dimensions. This allows capacitors of varying sizes to be accommodated within the same subassembly design, maintaining reliable electrical connections without requiring increased board space for larger capacitors or specialized mounting structures
4Reliability
If conventional capacitors are used for backup power in SSD devices, then the capacitors can provide power loss protection, but the manufacturing complexity increases due to the need to support multiple form factors
Solution Approach 1:
The patent implements a universal capacitor subassembly design that can be used across multiple SSD form factors (2.5-inch, 3.5-inch, and smaller form factors). The subassembly includes a capacitor, holder, and pre-compression mechanism that maintains consistent electrical and mechanical connections regardless of the SSD form factor, eliminating the need for form-factor-specific capacitor designs and reducing design time and inventory complexity
Solution Approach 2:
The patent separates the capacitor from the main PCB by implementing it as a discrete subassembly with its own holder and pre-compression mechanism. This segmentation allows the capacitor to be independently sourced, tested, and replaced without affecting the main board, simplifying manufacturing and assembly processes across different form factors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies engineering and inventory management, reduces costs, and enhances flexibility by allowing the same SSD main board to support various form factors with different PLI requirements, while also streamlining testing and assembly processes.
Implementation Method 1
Some devices may utilize capacitors to provide enough power to copy the information to nonvolatile memory
Data Source
AI summary
An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.


