Miniature Circuitry With Parylene Insulation For High Voltage
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Solution Overview
Problem
Existing miniature electrical circuits and inductors/transformers face challenges in achieving high functional reliability, high voltage, and high current capabilities while maintaining miniaturization and tolerance to physical stress.
Innovation Solution
A high-yield manufacturing process that fabricates multiple independent conductors in via holes with a high dielectric film, using ferrite members in printed circuit boards or flexible circuits, and employing parylene coatings for insulation, allowing for closely spaced conductors with high voltage barriers and efficient interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple independent conductors are fabricated in the same via holes with thin dielectric film, then device miniaturization is achieved, but voltage barrier and interconnect reliability may be compromised
Solution Approach 1:
The via hole is segmented into multiple independent conductor regions separated by dielectric material. Each conductor is electrically isolated from others within the same via hole, enabling multiple interconnects to pass through a single via while maintaining electrical separation and reliability despite reduced spacing.
Solution Approach 2:
The patent transitions from planar conductor arrangement to three-dimensional configuration within the via hole. Conductors are arranged in multiple layers separated by dielectric film, utilizing the vertical dimension to achieve miniaturization while maintaining adequate voltage barriers through the dielectric material.
2Volume of moving object
If conductors are closely spaced to achieve miniaturization, then device size is reduced, but high voltage barrier may be compromised
Solution Approach 1:
A dielectric material is introduced as an intermediary between closely spaced conductors within the via hole. This dielectric layer acts as an insulating barrier that prevents voltage breakdown and electrical breakdown between adjacent conductors, enabling close spacing while maintaining high voltage capability.
Solution Approach 2:
The patent employs thin dielectric film layers to separate conductors within the via hole. These thin films provide sufficient electrical insulation and voltage barrier properties while occupying minimal space, thereby enabling conductor close spacing without compromising high voltage performance.
3Reliability
If ferrite members are embedded in cavities to improve inductive performance, then functional reliability is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: the ferrite member is embedded directly in the circuit board cavity, and via holes are drilled through the ferrite to accommodate conductors. This merging of magnetic core and interconnect structure eliminates separate assembly steps and simplifies manufacturing while maintaining inductive performance.
Solution Approach 2:
The ferrite member serves multiple functions simultaneously: it provides the magnetic core for inductive operation, structural support for the via holes, and defines the cavity geometry. This multi-functionality reduces the number of separate components and assembly operations required, thereby simplifying manufacturing despite the embedded configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the construction of miniature devices with high reliability, efficient manufacturing, and high tolerance to physical stress, suitable for applications like laptop power supplies and portable electronics.
Implementation Method 1
two or more independent and isolated conductors in the same via holes... providing interconnect reliability... high dielectric film between plural plated through hole conductors
Implementation Method 2
two or more independent conductors are advantageously fabricated on the wall of a hole either in or proximate to a ferrite member embedded in a cavity in a printed circuit board
Implementation Method 3
two or more independent and isolated conductors in the same via holes... interconnect circuits and circuit elements located on opposite sides
Data Source
AI summary
Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.