Star-Structured SBS Triblock Copolymer Resin Composition
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Solution Overview
Problem
Current thermosetting resin compositions face issues with phase separation, which affects their heat resistance and dielectric properties, particularly in copper clad laminates, due to poor compatibility of components, leading to inconsistent thermal properties and reduced reliability.
Innovation Solution
A thermosetting resin composition incorporating a star-structured styrene-butadiene-styrene triblock copolymer, a linear 1,2-position vinyl-containing olefin resin, and a resin or small-molecule compound with acrylic groups, which form a homogeneous and dense crosslinking network, preventing phase separation and maintaining high heat resistance and low dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If SBS is added as compatibilizer to improve phase separation, then compatibility is improved, but glass transition temperature decreases and coefficient of thermal expansion increases
Solution Approach 1:
The patent changes the molecular structure parameter of the compatibilizer from linear SBS to star-structured SBS triblock copolymer. This structural parameter change allows achieving phase compatibility while maintaining high glass transition temperature and low coefficient of thermal expansion, as the star structure provides better compatibility without the negative effects of linear SBS
Solution Approach 2:
The patent creates a composite resin system combining unsaturated polyphenylene ether resin, polyolefin resin, and star-structured SBS triblock copolymer. This composite material approach achieves both phase compatibility and desired thermal properties through the synergistic effect of the components
2Stability of the object's composition
If more SBS is added to improve compatibility, then phase separation is reduced, but heat resistance and thermal stability deteriorate
Solution Approach 1:
The patent changes the structural parameter of the compatibilizer to star-structured SBS triblock copolymer, which provides superior compatibility at lower concentrations. This structural modification eliminates the trade-off between compatibility and heat resistance by achieving effective phase mixing without excessive SBS addition that would compromise thermal stability
3Quantity of substance
If olefin resin is used to achieve low dielectric constant and low dielectric loss, then dielectric properties are improved, but compatibility with other resins deteriorates causing phase separation
Solution Approach 1:
The patent introduces star-structured SBS triblock copolymer as an intermediary compatibilizer between unsaturated polyphenylene ether resin and polyolefin resin. The triblock structure with styrene blocks compatible with polyolefin and polyphenylene ether blocks compatible with the thermosetting resin creates a bridge that eliminates phase separation while preserving the low dielectric properties of the polyolefin component
Solution Approach 2:
The patent develops a composite resin system that combines unsaturated polyphenylene ether resin, polyolefin resin, and star-structured SBS triblock copolymer in specific proportions. This composite achieves both low dielectric constant and low dielectric loss tangent while maintaining phase homogeneity through the compatibilizing effect of the star SBS
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively relieves phase separation, ensuring high heat resistance, low dielectric constant, and low dielectric loss tangent value, thereby enhancing the thermal reliability and dielectric properties of copper clad laminates.
Implementation Method 1
form a homogeneous and dense crosslinking network, preventing phase separation
Implementation Method 2
a plurality of peroxides with different half-life temperatures, which are combined to form a composite crosslinking initiator and can effectively increase the crosslinking density during the thermal hardening process
Data Source
AI summary
The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.