Integrated Side Mirror Circuit with Segmented Heater and LED
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Solution Overview
Problem
The existing side mirror structures for blind spot detection (BSD) require separate substrates for heat generation and light emission circuits, increasing manufacturing complexity and weight, and limiting the transmission of light through film-type heaters.
Innovation Solution
A side mirror structure with a single substrate integrating a heat generation circuit and a light emission circuit, featuring a through-hole to separate these functions, using a flexible printed circuit board (FPCB) with copper-based hot wires and electric wires for efficient heat and light transmission, and an LED lamp for signaling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate substrates are used for heat generation circuit and light emission circuit, then functional separation is achieved, but device complexity and weight increase
Solution Approach 1:
The patent merges the heat generation circuit and light emission circuit into a single substrate. The substrate integrates both the heater circuit (with hot wires) and the light emission circuit (with LED lamps and electric wires), eliminating the need for separate substrates and reducing overall device complexity while maintaining functional separation through spatial arrangement.
2Temperature
If film-type heater is used for heat generation, then heating function is provided, but light transmission is blocked
Solution Approach 1:
The substrate is segmented into distinct functional areas: a first area for the heat generation circuit and a second area for the light emission circuit. This spatial segmentation allows the heater and LED components to operate independently without interfering with each other's functionality, enabling both heating and light transmission to coexist effectively.
3Reliability
If additional wiring is required for separate circuits, then circuit functionality is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the wiring for both heat generation and light emission circuits into a single substrate structure. The substrate provides integrated electrical connections for the hot wires, electric wires, and LED lamps, eliminating the need for separate wiring harnesses and simplifying the manufacturing process while ensuring reliable circuit functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration simplifies the manufacturing process, reduces costs, and maintains high LED brightness even at elevated temperatures, while enhancing heat generation performance and assembly efficiency.
Implementation Method 1
a heat generation circuit portion (300) that is provided at one side area in a top side of the substrate (100) and transmits heat to the mirror glass (200)
Implementation Method 2
transmits heat to the mirror glass
Implementation Method 3
a light emission circuit portion (400) that is provided at the other side area in a top side of the substrate (100) and displays a signal on the mirror glass (200)
Implementation Method 4
an LED lamp that is electrically connected to the electric wire
Data Source
AI summary
A side mirror structure includes: a substrate; a mirror glass that is disposed above the substrate; a heat generation circuit that is provided at a first area on a top surface of the substrate, and transmits heat to the mirror glass; and a light emission circuit that is provided at a second area on the top surface of the substrate, and displays a signal on the mirror glass.