Thermally Insulated PCB Dielectric Layer
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Solution Overview
Problem
High-density printed circuit boards (PCBs) face challenges in cooling electrical components due to increased heat generation, which can degrade the performance of heat-sensitive components like microprocessors and power switches.
Innovation Solution
Incorporation of a thermally and electrically insulating dielectric layer within the PCB between electrical components on opposite sides to minimize heat transfer, along with a heat sink to efficiently remove heat from the first side components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrical components are placed on both sides of the PCB to increase component density, then the quantity of electrical components is improved, but the temperature of components is worsened due to heat generation
Solution Approach 1:
The PCB is segmented into multiple layers with a thermally insulating dielectric layer inserted between the first and second conductive layers. This segmentation creates thermal zones that isolate heat-generating components on one side from heat-sensitive components on the other side, allowing high component density while controlling temperature
Solution Approach 2:
A thermally insulating dielectric layer is introduced as an intermediary between the first and second conductive layers. This intermediate layer blocks heat transfer from power-regulating components on the first side to microprocessors and sensitive components on the second side, enabling both high component density and temperature control
2Temperature
If a thermally insulating dielectric layer is added to the PCB to reduce heat transfer, then the temperature of sensitive components is improved, but the device complexity is worsened
Solution Approach 1:
The dielectric layer serves multiple functions simultaneously: it provides electrical insulation between conductive layers, thermal insulation to block heat transfer, and structural support within the PCB laminate. This multi-functionality reduces the need for additional separate components, minimizing the increase in device complexity while achieving temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat conduction from power-regulating components to microprocessors and other sensitive components, maintaining performance and accuracy by isolating heat sources and facilitating efficient heat dissipation.
Implementation Method 1
a thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components
Data Source
AI summary
A printed circuit board (PCB) including a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second side electrical components attached to the second side of the PCB and electrically connected to the conductive layer; and a thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components.