Display Apparatus Heat Sink with Rotating Guide Panel
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Solution Overview
Problem
Conventional display apparatuses face challenges in heat dissipation as they become thinner and lighter, and the attachment and detachment of circuit boards using double-sided adhesive tape are inconvenient during the assembly process.
Innovation Solution
A display apparatus with a heat sink plate coupled to the bottom surface of the display panel, featuring a semicircular coupling member and a guide panel with a connection member that allows for rotation or sliding attachment and detachment, maintaining an air gap to prevent direct contact and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the display apparatus is made thinner and lighter, then the portability and modern design are improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: a heat sink plate coupled to the display panel bottom surface, a guide panel with connection members, and a circuit board assembly. This segmentation allows each component to perform its specific function optimally while maintaining overall thinness, as the heat dissipation path is distributed across separate layers rather than requiring a single thick heat sink structure.
Solution Approach 2:
The patent transitions from conventional planar heat dissipation to a three-dimensional stacked architecture. The heat sink plate is positioned in the vertical dimension below the display panel, with the guide panel and circuit board arranged in layers beneath it. This vertical stacking enables effective heat dissipation without increasing the horizontal footprint, maintaining the thin profile while adding heat management capability in the Z-direction.
2Ease of manufacture
If double-sided adhesive tape is used to attach the circuit board to the guide panel, then the assembly process is simplified, but the ease of detachment and rework deteriorates
Solution Approach 1:
The connection system transitions from a static adhesive bond to a dynamic mechanical connection. The connection members feature rotating engagement mechanisms that allow the circuit board to be easily attached and detached through rotational motion. This dynamic connection maintains firm attachment during operation while enabling simple rework when needed, eliminating the permanence of adhesive bonding.
Solution Approach 2:
The guide panel serves as an intermediary component between the heat sink plate and the circuit board. It provides a platform with connection members that mediate the mechanical coupling, allowing the circuit board to be securely held during assembly while enabling easy detachment through the rotating connection mechanism, thus resolving the contradiction between secure attachment and easy rework.
3Volume of moving object
If the circuit board is positioned close to the display panel to reduce overall thickness, then the compactness is improved, but the heat transfer to the display panel increases
Solution Approach 1:
The heat sink plate acts as a thermal intermediary layer positioned between the circuit board and the display panel. It provides a dedicated heat dissipation path for the circuit board while preventing direct thermal coupling with the display panel. The guide panel serves as a mechanical intermediary that maintains the spatial separation required for thermal isolation while keeping the overall assembly compact through optimized layer thicknesses.
Solution Approach 2:
The patent applies different thermal management strategies to different regions: the heat sink plate provides localized heat dissipation directly beneath heat-generating components on the circuit board, while the guide panel maintains thermal isolation in regions where the circuit board approaches the display panel. This localized approach enables compact positioning without compromising thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents direct contact between the heat-generating circuit board and the display panel, improving heat dissipation performance and simplifying the assembly process by allowing easy attachment and detachment of the guide panel from the heat sink plate.
Implementation Method 1
a heat sink plate coupled to a bottom surface of the display panel
Implementation Method 2
maintaining an air gap to prevent direct contact and enhance heat dissipation
Data Source
AI summary
A display apparatus comprises a display panel; a heat sink plate coupled to a bottom surface of the display panel and having a coupling member that extends in a semicircular shape at one end and protrudes in a direction toward the bottom surface of the display panel; and a guide panel having a connection member at one end that is coupled to the coupling member in a rotation or sliding manner and connected to a bottom surface a printed circuit board (PCB) connected to the display panel, wherein the printed circuit board is detachably coupled to a bottom surface of the heat sink plate.