Bridge PCB for High-Speed Signal Routing
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Solution Overview
Problem
As the quantity of electrical signals transmitted and received by printed circuit boards (PCBs) increases, or when high-speed signal processing is required, the signal processing speed decreases, leading to performance deterioration. Increasing the number of PCB layers to enhance receiving capacity is costly and technically challenging.
Innovation Solution
The implementation of a PCB assembly that includes a main printed circuit board with multiple device areas and a bridge printed circuit board that crosses these areas vertically, transmitting power and signals without increasing the number of PCB layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the number of layers of the PCB is increased to enhance receiving capacity, then the signal processing speed is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The patent introduces a bridge printed circuit board that extends vertically from the main PCB, utilizing the third dimension (Z-axis) to create additional signal transmission pathways. This dimensional transition allows signals to be routed through multiple areas (first, second, third areas) without increasing the number of layers on the main PCB, thereby improving signal processing speed while avoiding the cost increase associated with multi-layer PCB manufacturing
2Reliability
If the number of layers of the PCB is increased to process high-speed signals, then the signal quality is improved, but the device complexity increases
Solution Approach 1:
The patent divides the signal transmission function into two separate components: the main PCB and the bridge PCB. The main PCB handles power supply and basic signal routing, while the bridge PCB is specifically dedicated to high-speed signal transmission across multiple areas. This segmentation allows each component to be optimized for its specific function, improving signal quality without requiring the entire PCB structure to be complex multi-layer construction
Data Source
AI summary
A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.