Bonding Tool Curvature Control for Void-Free Die-to-Wafer Bonding
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Solution Overview
Problem
Challenges exist in stacking semiconductor devices and reducing manufacturing costs, particularly in achieving precise alignment and avoiding voids or gaps during die-to-wafer bonding, which can lead to bonding failures.
Innovation Solution
A bonding tool and method that utilizes a bending member to deflect and deform a semiconductor die, allowing initial contact at the center area with the wafer, ensuring uniform pressure distribution and preventing voids or gas pockets by propagating the bond wave outwardly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to bond semiconductor die to wafer, then bonding process can be completed, but voids or gaps may form at the bonding interface leading to bonding failures
Solution Approach 1:
The bonding tool applies preliminary action by using a bending member to pre-deflect the semiconductor die into a curved shape before the bonding process. This pre-deflection ensures that the die makes initial contact with the wafer at the center area and progressively bonds outward, preventing voids from forming at the bonding interface before the bonding process even begins.
Solution Approach 2:
The bonding tool applies spheroidality by using a bending member to deflect the semiconductor die into a curved or arc-shaped configuration during bonding. This curvature ensures that the die contacts the wafer in a controlled manner from the center outward, eliminating gaps and voids at the bonding interface that would occur with flat, conventional bonding approaches.
2Manufacturing precision
If uniform pressure distribution is desired during bonding, then bonding quality improves, but conventional bonding tools cannot achieve uniform pressure distribution
Solution Approach 1:
The bonding tool achieves uniform pressure distribution by deflecting the semiconductor die into a curved shape using a bending member. This curvature naturally distributes the bonding pressure uniformly across the die-wafer interface as the bond wave propagates outward from the center, eliminating pressure non-uniformity without requiring complex multi-point pressure control systems.
Solution Approach 2:
The bonding tool applies parameter changes by dynamically altering the shape of the semiconductor die during bonding through the bending member. By changing the die's curvature parameter in real-time, the system achieves uniform pressure distribution and prevents void formation, simplifying the overall tool structure compared to systems that would require active pressure regulation at multiple points.
3Productivity
If semiconductor devices are stacked to reduce physical size, then device density increases, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The bonding tool applies preliminary action by pre-deflecting the semiconductor die into a precise curved shape before bonding. This pre-positioning ensures that when the die is stacked onto the wafer, the alignment is already optimized, allowing for high device density stacking while maintaining precise alignment through the controlled arc-shaped contact pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures uniform bonding pressure distribution and avoids voids or gas pockets, enhancing the bonding performance and reducing the likelihood of failures.
Implementation Method 1
a bending member to deflect and deform a semiconductor die
Implementation Method 2
the suction holes provide a suction force to hold the semiconductor die
Data Source
AI summary
A bonding tool and a bonding method are provided. The method includes: providing a bonding tool having a first surface, wherein the bonding tool comprises a plurality of suction holes and a bending member movably arranged in a trench of the bonding tool; attaching a semiconductor die by the bonding tool to contact a semiconductor wafer with a partial bonding, wherein the suction holes provide a suction force to hold the semiconductor die; causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding while keeping the suction force to hold the semiconductor die at the same time; and releasing the semiconductor die from the bonding tool by removing the suction force subsequent to the full bonding.