Bonding Tool Groove Structure for Stable Thermal Compression
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Solution Overview
Problem
Existing semiconductor manufacturing equipment faces challenges in maintaining stable adhesion between the bonding tool and the head heater during the chip bonding process, leading to potential detachment and process delays, which can result in defects.
Innovation Solution
The equipment incorporates grooves on the bonding tool's surface that communicate with negative pressure channels in the head heater, increasing the area of contact and enhancing adhesion through controlled negative pressure application, while also rounding the vertices to maintain consistent pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If negative pressure channels are provided only on the head heater, then the structure is simple, but the adhesion between bonding tool and head heater is insufficient
Solution Approach 1:
The patent combines the negative pressure channels into a single integrated component formed by the groove structure on the bonding tool surface. This merging approach increases adhesion strength while avoiding the complexity of separate channel structures, as the groove itself creates the negative pressure application pathway.
Solution Approach 2:
The groove structure on the bonding tool surface creates a porous-like configuration that allows negative pressure to be applied through multiple pathways. This increases the effective contact area and adhesion force without requiring complex internal channel networks.
2Stability of the object's composition
If negative pressure is applied only at specific points, then the structure is simple, but the pressure distribution is uneven causing detachment
Solution Approach 1:
The patent transitions from point-based or linear negative pressure application to a two-dimensional groove structure on the bonding tool surface. This dimensional expansion ensures uniform pressure distribution across the entire contact area, preventing localized detachment while maintaining structural simplicity.
3Area of stationary object
If the bonding tool surface is flat, then the manufacturing is simple, but the negative pressure application area is insufficient
Solution Approach 1:
The patent segments the flat bonding tool surface by introducing grooves that create distinct negative pressure application zones. This segmentation increases the effective pressure application area and improves adhesion, while the groove geometry remains simple enough for conventional manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the stability and speed of the bonding process by ensuring secure attachment of the bonding tool to the head heater, reducing defects and process delays.
Implementation Method 1
negative pressure channels recessed from the thermal compression surface and the negative pressure channels including first holes therein... the grooves are in communication with the negative pressure channels so that the negative pressure supplied to the first holes is applied to the negative pressure channels and the grooves together
Data Source
AI summary
Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.