Bonding Tool Trench for Expanded Release Tape
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Solution Overview
Problem
Conventional electronic packaging methods face issues with overhangs in multi-chip implementations, where the expansion of fluorinated release tapes due to heat forms folded lines on underfill materials, leading to decreased wire bonding performance, chip breakage, and contamination of adjacent components.
Innovation Solution
An electronic packaging apparatus with a bonding tool that incorporates a trench surrounding the suction openings to accommodate the expanded release tape, preventing folded lines from forming on the underfill material by directing the expanded tape outside the adhesive agent area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied to mount the chip, then the chip is bonded to the substrate, but the fluorinated release tape expands and forms folded lines on the underfill material
Solution Approach 1:
The bonding tool is segmented into distinct functional zones: a chip holding area with suction openings and a tape accommodation trench. This segmentation allows the tape to be physically separated from the underfill material area, preventing folded lines from forming on the underfill surface while maintaining bonding effectiveness.
Solution Approach 2:
The expanded tape is extracted or removed from the bonding area by directing it into the dedicated accommodation trench. This extraction prevents the tape from interfering with the underfill material, eliminating the root cause of folded line formation while preserving the necessary heating and bonding functions.
2Stability of the object's composition
If the release tape is held by suction force during heating, then the tape remains in position, but the tape still expands and creates folded lines that transfer to the underfill material
Solution Approach 1:
The accommodation trench acts as an intermediary structure between the expanding tape and the underfill material. It provides a designated space for the tape to expand into, serving as a buffer that prevents direct contact between the folded tape and the underfill surface, thereby eliminating the harmful folded line transfer.
Solution Approach 2:
Different areas of the bonding tool are given different functional qualities: the chip holding area maintains suction for stable positioning, while the accommodation trench provides a dedicated space for tape expansion. This local differentiation allows each zone to perform its specific function without interfering with the other, preventing folded line formation on the underfill material.
3Reliability
If adhesive agent is applied to support overhang, then upper chip stability is improved, but excess adhesive agent may contaminate adjacent components
Solution Approach 1:
The harmful factor (excess adhesive agent) is extracted or prevented from reaching adjacent components by maintaining a clean bonding surface. The accommodation trench ensures the tape does not create folded lines on the underfill, and the precise adhesive application supported by stable chip positioning prevents adhesive overflow onto adjacent components, eliminating contamination risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents folded lines on the underfill material, enhancing wire bonding performance, reducing chip breakage, and minimizing contamination, while supporting overhangs with a flattened adhesive surface.
Implementation Method 1
a bonding tool having a suction opening holds an electronic component against a release tape by a suction force
Implementation Method 2
the fluorinated tape is not held in place: due to heat (for example, approximately 200° C. or higher) coming from the bonding tool during chip mounting, the fluorinated tape that is made of, for example, a polytetrafluoroethylene (PTEE) film is expanded and a folded line is formed
Data Source
AI summary
A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.