Bonding Wire Fixing Feature to Prevent Corner Shorts
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Solution Overview
Problem
The existing methods for connecting electronic components to substrates using bonding wires often result in wires being disposed against the corners of the components, leading to potential breakage and electrical shorts, increasing the size and resistance of semiconductor devices.
Innovation Solution
Incorporating a fixing feature on the substrate or electronic component that physically separates the bonding wire from the corner, allowing the wire to be partially disposed on this feature, thereby reducing its length and preventing shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding wire is lengthened to prevent it from being disposed against the corner of the electronic component, then the risk of electrical shorts is reduced, but the size of the semiconductor device and the resistance of the bonding wire increase
Solution Approach 1:
A fixing feature is introduced as an intermediary element between the bonding wire and the corner of the electronic component. This fixing feature is attached to the substrate and provides a surface for the bonding wire to rest on, physically separating the wire from the component corner without requiring the wire to be lengthened. The fixing feature acts as a mediator that maintains safety clearance while allowing optimal wire length.
2Reliability
If the bonding wire is lengthened to prevent contact with the corner of the electronic component, then electrical shorts are prevented, but the resistance of the bonding wire increases
Solution Approach 1:
The fixing feature serves as a mediator structure that allows the bonding wire to maintain an optimal path between the electronic component and substrate. By providing a dedicated surface for wire placement, the fixing feature enables the wire to be positioned safely away from component corners without excessive lengthening, thereby minimizing resistance and energy loss while preventing electrical shorts.
3Area of stationary object
If the bonding wire is disposed against the corner of the electronic component, then the size of the semiconductor device is reduced, but the bonding wire may break or cause electrical shorts
Solution Approach 1:
The fixing feature is positioned between the bonding wire and the corner of the electronic component, serving as a protective intermediary. This structure allows the bonding wire to be routed close to the component without直接接触 the corner, maintaining compact device size while preventing wire breakage and electrical shorts through physical separation.
4Reliability
If a fixing feature is added to separate the bonding wire from the corner of the electronic component, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The fixing feature is implemented as a separate, discrete element attached to the substrate, distinct from both the electronic component and the bonding wire. This segmentation allows the fixing feature to be independently designed, positioned, and optimized for its specific function of wire support and separation, simplifying the overall system architecture while improving reliability.
Data Source
AI summary
The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing a substrate. The method also includes attaching an electronic component to the substrate. The method further includes attaching a fixing feature to an upper surface of the electronic component. In addition, the method includes forming a bonding wire connecting the substrate and the electronic component. The bonding wire is at least partially disposed on the fixing feature.