Bonding Wire Support Structure for Complex Geometry Routing
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Solution Overview
Problem
Existing wire bonding methods face challenges in complex geometries, such as maintaining insulation distance and guiding bonding wires between components arranged at right angles, often requiring additional effort and specialized preparation of components or tools.
Innovation Solution
The use of metallic supports with solderable foot sections, surface-mounted using SMT technology, which can be made from sheet metal or wire sections, and feature resilient receptacles to secure the bonding wire, allowing for flexible routing and reducing load on bonding points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If standard wire bonding is used without supports, then the bonding process is simple, but it is impossible to maintain insulation distance and guide wires in complex geometries
Solution Approach 1:
The patent introduces support structures as intermediary elements between the PCB and bonding wires. These supports serve as mediators that guide the wires and maintain insulation distances without interfering with the bonding process itself. The supports are simple metallic structures (pins or clips) that provide physical guidance and positioning.
Solution Approach 2:
The support structure is segmented into discrete, independent elements (individual pins or clips) rather than a continuous complex framework. Each support element is a separate component that can be independently positioned and attached to the PCB, simplifying both the design and manufacturing process.
2Adaptability or versatility
If components are arranged at right angles, then space utilization is improved, but wire guiding becomes impossible with standard bonding tools
Solution Approach 1:
The support structures act as intermediaries that adapt to various component arrangements including right-angle configurations. By providing physical guides and routing paths, the supports enable wire bonding operations in geometries that would otherwise be inaccessible to standard bonding tools, thus maintaining ease of operation while achieving design flexibility.
Solution Approach 2:
The support structures extend the bonding wire routing into three-dimensional space, allowing wires to navigate around obstacles and between components arranged at different orientations. The supports create elevated routing paths and lateral guidance structures that enable wire bonding in multi-dimensional component layouts.
3Length of stationary object
If bond wires are stretched over long distances, then connection coverage is improved, but insulation distance to components cannot be maintained
Solution Approach 1:
The support structures serve as intermediary positioning elements that maintain insulation distances along the entire wire path, not just at endpoints. By providing continuous physical guidance and elevation, the supports ensure that even long-span wires maintain adequate clearance from components and PCB surfaces throughout their routing path.
Solution Approach 2:
The supports elevate the wire routing from the PCB plane into the third dimension (vertical space), creating clearance between the wires and component surfaces. This vertical separation maintains insulation distances while allowing wires to span long horizontal distances without contacting other components.
4Reliability
If supports are added to guide wires, then bonding reliability is improved, but manufacturing effort increases
Solution Approach 1:
The support structure is divided into simple, discrete elements (individual pins or clips) that can be manufactured using standard PCB fabrication processes. Each element is a basic metallic component requiring minimal processing, and can be attached to the PCB using conventional through-hole or surface-mount techniques, thus avoiding complex manufacturing steps.
Solution Approach 2:
The support structures are implemented as simple, low-cost metallic elements rather than complex reusable fixtures. These supports are inexpensive to manufacture and attach, and their function is fulfilled during the bonding process without requiring recovery or reuse, making them economically viable despite adding manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure bonding in complex geometries with reduced effort and cost, allowing for any desired routing of bonding wires while preventing accidental detachment and ensuring insulation, thus improving the bonding process efficiency and reliability.
Implementation Method 1
at least one support with a metallic, solderable foot section is soldered onto a solder pad of the component and surface-mounted using SMT technology
Implementation Method 2
Simultaneously, ultrasonic vibrations are generated in the bonding head, bonding the wire to the contact pad at the atomic level
Data Source
Figure 1~2
Figure 3a~4f
AI summary
An electronic component (1) with electrical connection points (50, 5u), in which at least one bond wire (4) is guided from at least one first connection point (50) across the component surface to at least one second connection point (5u), wherein a bond connection of the wire with a contact surface of the connection point is established at the at least first and at least the second connection point, wherein at least one support (6) for the at least one bond wire (4) is provided on the component (1) and at least one bond wire is held between a first connection point (50) and a second connection point (5u) from the support at a predetermined distance from surface sections of the component, and a method for manufacturing such a component, in which at least one support (6) for the bond wire is erected on the component (1) before guiding the bond wire (4) from a first (50) to a second (5u) connection point.which holds the bond wire at a predetermined distance from surface sections of the component.