Printed Circuit Assembling TRIZ Cases

A tiered circuit board with offset edges forms steps for conductive pads to interface twinaxial ribbon cables.

Curved flexible printed circuits link opposing boards to erect a three-dimensional volume, eliminating complex connectors and soldering steps.

A printed wiring board uses a thinner second insulation layer to create a flat outer surface for component mounting.

A capacitive touch panel uses a face-to-face ITO layer configuration with a single flexible printed circuit connector to join conductive traces.

Plated metal connector regions extend continuously between microelectronic components, reducing signal propagation time while maintaining mechanical support.

A coreless wiring board fabrication method uses a preliminary solder resist layer to maintain flatness during build-up processing.

A solder structure uses a high-melting ball and low-melting connector to maintain height during polymer molding.

Segmented guides accommodate thermal expansion and positional shifts, ensuring reliable power transmission despite component movement.

A multi-layer structure combines a rigid structural layer with a conductive layer to disperse heat.

Low-elastic modulus conductive layers buffer thermal stress at resin boundaries, preventing wiring breaks while maintaining electrical conductivity.

Segmented devices replace complex robots to mount terminal blocks on rails, resolving the trade-off between operational ease and system complexity.

Segmented metallic supports elevate bond wires above component surfaces, maintaining insulation distances in complex geometries without specialized tooling.

Low-rigidity resin connections between capacitor electrodes and lead frames absorb molding pressure and thermal expansion forces.

A sequential soldering method for electronic modules uses global heating followed by local electrode heating to fuse components.

Optimized Sn-Ag-Bi-In-Cu solder maintains indium content stability during bonding.

Segmented ceramic plates and air gaps minimize heat transfer to the tool body, maintaining wafer flatness during thermocompression bonding.

Pre-cured adhesive fixes BGA shape during re-flow, maintaining edge ball contact and boosting yield.

Light guide films diffuse source illumination across icons while isolation blocks partition segments to prevent light bleeding between portions.

Converging tilted pad lines compensate for material elongation differences during bonding, ensuring accurate alignment and reducing defects.

An electro-conductive pressure-sensitive adhesive tape uses bimodal particle sizing to balance conductivity and adhesive force.

Support wall portions clamp the flexible printed circuit base part within a resin molded body, preventing separation under pulling force during operation.

Voltage profiles break down dielectric oxide layers, forming conductive paths that reduce contact resistance without inert gas environments.

Segmenting the adhesive into discrete regions reduces warpage and distortion caused by uneven stress distribution in integrated circuit packages.

Removing plugs from a laminated stack exposes inner core circuitry protected by a dummy core, resolving the trade-off between rigidity and bendability.

A T-shaped core and air-core coil embed in a magnetic resin mixture with an exposed ground connection electrode.

Adhesive layer positions bond wires near the neutral axis, reducing stress on conductors during repeated flexing.

A camera evaluates an electronic component to align a circuit carrier with a housing opening.

Depressed solder layers reduce volume while maintaining bonding strength, preventing irregular mounting and ensuring reliable grounding.

An electrostatic transfer stamp charges selected regions to pick up and move semiconductor dice via Coulomb forces.

A cylindrical metal pile penetrates a printed wiring board to follow insulated circuit board warps.

A semiconductor bump coating integrates solder powder and thermosetting resin to form a reinforcing structure during reflow.

A circuit module component uses an oxide film on terminal electrode side faces to inhibit solder spread during reflow.

Radial strip assembly resolves poor heat dissipation and complex assembly by enabling multi-directional light emission.

Segmented components and automated soldering resolve industrialization bottlenecks in fitting torus-shaped Rogowski coils for accurate current measurement.

A solar cell module uses pressure-sensitive insulating adhesive to temporarily fix interconnectors at room temperature during lamination.

Conductive folding guides reduce electromagnetic interference between densely packed circuit boards by providing shielding through U-shaped sidewalls.

Elevated holding element creates receiving space between electronic component and printed circuit board.

A shielding dielectric layer extends across a package surface to create a controlled electrical environment.

Segmented preformed laminates join via interlayer bonding to embed components, resolving low yield and long cycle times in custom fabrication.

Elastic cushioning members absorb vibration energy to prevent pins from piercing insulating layers, enhancing electronic device reliability.

Thermal vias and wiring in a component built-in board conduct heat directly to a mounting board, eliminating separate radiation boards that increase thickness.

A flexible printed circuit shield layer dissipates electrostatic charges to ground while maintaining insulation from internal drive circuits.

Carrier layers use iron-nickel alloys to match component thermal expansion, resolving dimensional instability during temperature changes.

Thick Sn-based solder layers containing Ag-Sn intermetallic compounds prevent oxidation and reduce contact electrical resistance under high temperature cycling.

A vacuum heat-bonding device uses a heated buffer part to transfer thermal energy directly to workpieces for rapid processing.

A via hole structure uses a low-dielectric filling layer to increase impedance and improve signal continuity.

Differential material placement on the core member and body controls solder flow during reflow, resolving reliability versus cost trade-offs.

An epoxy-silicone hybrid paste forms a peelable mask on flexible circuit substrates to protect conductive patterns during rigid substrate buildup.