Semiconductor Bump Coating for Enhanced Mounting Reliability

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Solution Overview

Problem

The existing solder bonding methods for semiconductor components on circuit boards often result in insufficient retention force due to inadequate bonding reinforcement, leading to reliability issues, particularly when thermosetting resin compositions interfere with electrical connections and fail to adequately reinforce the periphery of solder bonds.

Innovation Solution

A semiconductor component with a mountable face featuring bumps made of first solder and a coating part composed of second solder powder, a flux component, and a thermosetting resin binder, which increases the reliability of the connection by forming a resin reinforcing part around the solder bonding area during the reflow process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If solder bonding alone is used to mount semiconductor component on circuit board, then the process is simple, but the retention force is insufficient

Engineering Contradiction:

Improvemounting process simplicityVSAvoidretention force

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent merges solder bonding with resin reinforcing by integrating both functions into a single coating part. The coating part contains both solder powder (for bonding) and thermosetting resin (for reinforcement), eliminating the need for separate soldering and resin application steps while achieving both electrical connection and mechanical strength.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The coating part is formulated as a composite material containing solder powder, flux component, and thermosetting resin binder. This composite structure provides both the electrical conductivity and bonding strength of solder and the mechanical reinforcement and insulation of resin, resolving the contradiction between simple soldering and strong retention.

Inventive Principle:

Principle #40Composite materials

2Strength

If thermosetting resin is used to reinforce bonding, then the bonding strength is improved, but electrical connection may be interfered with

Engineering Contradiction:

Improvebonding strengthVSAvoidelectrical connection reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The coating part is applied locally only on the bump surface where electrical connection is needed. The solder powder within the coating part ensures electrical conductivity at the bonding interface, while the thermosetting resin provides mechanical reinforcement. This localized application prevents resin from interfering with electrical connections while still achieving bonding strength enhancement.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The solder powder acts as an intermediary between the electrical connection requirement and the mechanical reinforcement requirement. It provides the electrical conductivity pathway while the thermosetting resin provides structural support, allowing both functions to coexist without interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If resin-reinforcing solder paste is used, then the bonding is reinforced, but the composition complexity increases

Engineering Contradiction:

Improvebonding reinforcementVSAvoidcomposition complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The coating part is designed as a multi-functional material that simultaneously provides solder bonding, flux action, and resin reinforcement. This universal coating part replaces multiple separate materials (solder paste, resin paste, flux) with a single integrated composition, reducing process complexity while maintaining bonding reinforcement benefits.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the mounting reliability of semiconductor components by providing a robust resin reinforcing structure that maintains electrical insulation and mechanical bonding, effectively addressing the limitations of previous methods by ensuring higher bonding strength and reliability under thermal cycles and drop tests.

Implementation Method 1

a first thermosetting resin binder, and coats a top end of the bump

Methodology Applied

Scientific EffectThermosetting:

Implementation Method 2

a flux component, and a first thermosetting resin binder

Methodology Applied

Scientific EffectFlux action:

Data Source

PatentUS9925612B2Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

Publication Date: 2018.03.27 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A semiconductor component includes a semiconductor package having a mountable face, a bump, and a coating part. The bump is made of first solder and is formed on the mountable face. The coating part formed of a first composition containing solder powder made of second solder, a flux component, and a first thermosetting resin binder coats the top end of the bump.