Plated Metal Connector Regions for Microelectronic Assembly
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Solution Overview
Problem
Current microelectronic assemblies, including interposers and microelectronic elements, face limitations in achieving efficient electrical connections and compact size, which affects signal propagation speed and assembly reliability.
Innovation Solution
A method of forming microelectronic assemblies by assembling components with plated metal connection elements and connector regions that extend continuously between corresponding surfaces, using seed layers and dielectric layers to facilitate electrical connections, and forming barrier regions for insulation, allowing for precise spacing and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional solder balls or lands are used for connecting components, then the assembly process is simpler, but the electrical connectivity and signal propagation speed are insufficient
Solution Approach 1:
The connection structure is divided into multiple functional segments: plated metal connector regions for electrical connection, barrier regions for insulation, and dielectric layers for mechanical support. This segmentation allows each component to be optimized independently, improving electrical connectivity while maintaining manageable complexity through modular design.
Solution Approach 2:
The invention transitions from traditional planar solder connections to three-dimensional plated metal structures that extend between components. The plated metal connector regions create vertical electrical pathways, adding a dimensional aspect to connections that improves signal propagation speed and electrical connectivity beyond what flat solder lands can achieve.
2Volume of moving object
If components are placed closer together to reduce assembly size, then the overall assembly becomes more compact, but signal propagation time increases
Solution Approach 1:
By creating vertical plated metal connector regions that extend between components, the invention establishes direct electrical pathways that reduce signal propagation distance. This three-dimensional connection approach allows components to be placed closer together while maintaining fast signal transmission through the plated metal structures.
Solution Approach 2:
The combination of plated metal regions with high electrical conductivity and dielectric layers with appropriate mechanical properties creates a composite connection structure. This composite approach enables compact component spacing while maintaining optimal signal propagation characteristics through the plated metal pathways.
3Reliability
If plated metal connector regions with barrier regions are used, then electrical insulation is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming plated metal connector regions, depositing barrier regions, and adding dielectric layers. This segmentation allows each manufacturing step to be independently optimized and controlled, improving electrical insulation while making the overall complex process more manageable through systematic breakdown into discrete operations.
4Area of stationary object
If chip scale packages are used to reduce assembly area, then the overall size is minimized, but mechanical support and thermal management become challenging
Solution Approach 1:
The invention uses composite structures combining plated metal regions, barrier regions, and dielectric layers to create mechanically robust connections in a compact footprint. The dielectric layers provide mechanical support and structural integrity, while the plated metal regions provide electrical connectivity, achieving both miniaturization and mechanical strength.
Solution Approach 2:
By transitioning to three-dimensional plated metal connector regions and multi-layer dielectric structures, the invention achieves mechanical support and thermal management capabilities in the vertical dimension while maintaining a compact horizontal footprint. This vertical integration allows chip-scale dimensions to be achieved without sacrificing mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances electrical connectivity, reduces signal propagation time, and enables more compact assemblies with improved mechanical support and thermal management, addressing the limitations of existing technologies.
Implementation Method 1
plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element
Implementation Method 2
forming first and second dielectric layers overlying, respectively, the first and second seed layers and sidewall surfaces of the first and second plated metal regions
Implementation Method 3
forming a plurality of barrier regions overlying at least some of the plated metal connector regions
Data Source
AI summary
Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.