Low-Elastic Modulus Layers for Wiring Line Stress Relief
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Solution Overview
Problem
Electronic component devices with embedded wiring lines in resin structures are prone to breaks due to thermal stress caused by differences in linear expansion coefficients between the resin and the electronic components, and reducing wiring line thickness to minimize this stress increases ohmic loss.
Innovation Solution
Incorporating low-elastic modulus layers made of conductive materials, such as metal-resin composites, between the wiring lines and the resin structure at strategic boundaries to reduce thermal stress and maintain low ohmic loss, while ensuring electrical connectivity through through electrodes or side surface connection electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin layer is placed below a wiring line to reduce thermal stress, then the reliability of the wiring line is improved, but the thickness of the electronic component device increases
Solution Approach 1:
The patent applies local quality by placing the low-elastic modulus layer only at specific critical positions where wiring lines cross boundaries between resin structures and electronic components, rather than using a full resin layer throughout. This localized approach reduces thermal stress at the most vulnerable points while minimizing the overall thickness increase of the device.
Solution Approach 2:
The patent uses composite materials by creating a low-elastic modulus layer through a two-step process: first forming a conductive paste layer containing resin and metal particles, then selectively removing the resin portion to leave a metal particle matrix. This composite structure provides both mechanical compliance (low elastic modulus) and electrical conductivity, resolving the contradiction between reliability and thickness.
2Length of stationary object
If the thickness of the wiring line is reduced to reduce device profile, then the device thickness is reduced, but the ohmic loss increases
Solution Approach 1:
The patent merges multiple functions into the low-elastic modulus layer: it provides mechanical stress relief, maintains electrical conductivity through the conductive material, and enables thin wiring line design. By combining these functions in a single layer, the patent achieves reduced device thickness without increasing ohmic loss, as the conductive material compensates for the reduced wiring line thickness.
3Stability of the object's composition
If the elastic modulus of the wiring line is increased to reduce deformation, then the structural stability is improved, but the stress concentration at boundaries increases leading to breaks
Solution Approach 1:
The patent introduces a low-elastic modulus layer as an intermediary between the high-elastic modulus wiring line and the resin structure. This intermediary layer acts as a buffer that absorbs thermal stress and prevents stress concentration at the boundary, allowing the wiring line to maintain its structural stability without experiencing breaks due to stress concentration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents breaks in wiring lines and reduces ohmic loss by distributing thermal stress and maintaining electrical conductivity, thereby enhancing the reliability and efficiency of electronic component devices.
Implementation Method 1
a high stress is generated because of the difference in coefficients of linear expansion between the resin structure and the electronic component
Implementation Method 2
a low-elastic modulus layer that is provided at a height position between the first wiring line and the exposed portion of the electronic component
Implementation Method 3
a low-elastic modulus layer that is provided at a height position between the first wiring line and the exposed portion of the electronic component... and is made of a conductive material
Data Source
AI summary
An electronic component device includes an electronic component embedded in a resin structure and including a portion exposed on a first main surface of the resin structure, first wiring lines extending from the first main surface of the resin structure to the electronic component and electrically connected to the electronic component, second wiring lines on a side of a second main surface of the resin structure and electrically connected to respective connection electrodes that are electrically connected to the first wiring lines, and low-elastic modulus layers at a height position between the first wiring lines and the exposed portion of the electronic component in respective regions in which the first wiring lines straddle boundaries between the resin structure and the electronic component, having elastic moduli lower than those of the first wiring lines, and made of a conductive material.