Optical Unit Circuit Carrier Alignment Using Component Fiducials
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Solution Overview
Problem
Existing methods for aligning optoelectronic components with housing components in optoelectronic applications lack accuracy and introduce additional tolerances, requiring complex and costly fiducial structures and mechanical aids.
Innovation Solution
The electronic component itself is used as a fiducial for alignment, eliminating intermediate structures and using optical evaluation with a camera for precise positioning, followed by mechanical fixation methods like laser welding or hot stamping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If fiducial structures and mechanical positioning aids are used for alignment, then alignment can be achieved, but alignment accuracy is reduced due to accumulated tolerances from multiple alignment steps
Solution Approach 1:
The patent removes fiducial structures and mechanical positioning aids from the alignment system. Instead of using separate reference elements, the electronic component itself serves as the alignment reference, eliminating the need for additional fiducial markers and mechanical aids that introduce tolerance accumulation.
Solution Approach 2:
The patent combines the alignment reference function with the electronic component itself. The component serves dual purposes: as the functional element and as the alignment reference, eliminating the need for separate fiducial structures and reducing the number of alignment steps.
2Manufacturing precision
If multiple alignment steps with mechanical positioning aids are used, then positioning can be achieved, but production time increases due to multiple alignment operations
Solution Approach 1:
The patent performs alignment based on the electronic component's own features during the assembly process itself, rather than requiring preliminary alignment steps with separate fiducial markers. The component serves as its own alignment reference from the start of the assembly operation.
Solution Approach 2:
The electronic component serves itself as the alignment reference, eliminating the need for external fiducial structures. The component's own geometric features are used for alignment, making the system self-sufficient and reducing the number of operations required.
3Measurement precision
If fiducial structures are provided on the circuit carrier, then alignment reference is available, but manufacturing cost increases due to additional structures
Solution Approach 1:
The patent eliminates fiducial structures from the circuit carrier design. Instead of adding separate reference elements during manufacturing, the system uses the electronic component's own features as the alignment reference, simplifying the manufacturing process.
Solution Approach 2:
The electronic component serves multiple functions: as the functional device and as the alignment reference. This multi-functionality eliminates the need for dedicated fiducial structures, reducing manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves higher alignment accuracy with reduced tolerances and simplified production, enhancing the precision of optoelectronic component placement within housing components, particularly beneficial for applications like light curtains and sensors.
Implementation Method 1
heating and melting of the housing component by means of a laser beam
Implementation Method 2
fixing the aligned structure to one another by means of laser welding
Implementation Method 3
heating and melting of the housing component by means of ultrasonic vibration
Implementation Method 4
fixing the aligned structure to one another by means of ultrasonic welding
Data Source
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AI summary
The present invention relates to a method for assembling a circuit carrier with a housing component and furthermore to an optical unit for emitting and/or receiving radiation that is fabricated using this particular method of assembling and aligning the circuit carrier with the housing component. The method comprises the following steps: providing said circuit carrier, wherein on said circuit carrier there is arranged at least one electronic component, and providing said housing component having at least one first opening; aligning said circuit carrier in a way that said electronic component is aligned with respect to said first opening in the housing component, wherein the electronic component is directly used as a fiducial for its own position on the circuit carrier; fixing the circuit carrier at the housing component.