Embedded Component Package Structure with Preformed Laminate Segmentation

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Solution Overview

Problem

The fabrication of embedded component package structures with varying electric properties is challenging due to low yield and long cycle times, necessitating custom-made solutions that are costly and inefficient.

Innovation Solution

A method involving preformed laminate structures with metal and dielectric layers, an interlayer, and a drilling process to create cavities and plated-through holes, allowing for the embedding of electronic components within an encapsulant, which simplifies the fabrication process and increases productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If custom-made fabrication is used for embedded component package structures with various electric properties, then the structure can accommodate different electronic components, but the yield is low and cycle time is long

Engineering Contradiction:

Improveaccommodation of electronic components with various electric propertiesVSAvoidyield and cycle time

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The package structure is divided into multiple laminate structures (first laminate structure, second laminate structure, third laminate structure) that can be independently fabricated and then assembled together. This segmentation allows standardization of each module while maintaining overall adaptability to different electronic components, thereby improving yield and reducing cycle time.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The laminate structures are designed with universal features such as standardized bonding pads, plated-through holes, and cavity configurations that can accommodate various electronic components with different electric properties. This universality enables a single fabrication process to serve multiple component types, increasing productivity without sacrificing adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If custom-made fabrication is used for embedded component package structures, then specific electric properties can be achieved, but production costs increase

Engineering Contradiction:

Improvespecific electric propertiesVSAvoidproduction costs

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By segmenting the package into standardized laminate modules, each module can be fabricated using common manufacturing processes and materials. This reduces tooling costs and setup expenses associated with custom-made solutions, while still allowing customization through different combinations of standardized modules.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention achieves specific electric properties by varying parameters such as the number of metal layers, dielectric material selection, and conductor trace configurations within standardized laminate structures. These parameter changes allow customization without requiring entirely custom fabrication processes, thereby controlling production costs.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If multiple laminate structures are joined with interlayer, then embedded component package structure can be formed, but fabrication process complexity increases

Engineering Contradiction:

Improveembedded component package structure formationVSAvoidfabrication process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The laminate structures are pre-fabricated with predetermined features including bonding pads, plated-through holes, and cavity formations before assembly. This preliminary action simplifies the final assembly process, as the complex features are already in place and only require joining with the interlayer, rather than being created during the assembly stage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Multiple functions are merged into the interlayer joining process, which simultaneously bonds the laminate structures together, provides electrical connections through plated-through holes, and seals the cavity spaces. This consolidation of functions into a single operation reduces the number of discrete fabrication steps and overall process complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances productivity and reduces production costs by enabling the efficient assembly of embedded component package structures compatible with existing manufacturing processes, improving yield and reliability while protecting electronic components.

Implementation Method 1

the interlayer is made of a no-flow pre-impregnated material and joining the first and second laminate structures with the interlayer comprises performing a thermal compression process

Methodology Applied

Scientific EffectThermal compression:

Data Source

PatentUS8284561B2Embedded component package structure

Publication Date: 2012.10.09 ADVANCED SEMICON ENG INC

AI summary

The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures and mounting at least one electronic component to the joined structures. By way of the fabrication methods, the production yield can be greatly improved with lower cycle time.