Electrostatic Transfer Stamp for Sub-300um Semiconductor Dice
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Solution Overview
Problem
Conventional methods are inadequate for efficiently transferring small semiconductor dice from a host substrate to a target substrate due to thermal management issues and high initial costs associated with LED devices, and existing technologies struggle to handle devices smaller than 300 um using conventional pick and place technology.
Innovation Solution
An electrostatic transfer stamp with a light-transmitting substrate and a series of strata, including a charge transfer outer layer, is used to electrostatically charge regions for transferring semiconductor dice from a host substrate to a target substrate, utilizing electrostatic forces to pick up and release the dice onto the target substrate, with optional adhesive bonding to ensure successful transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pick and place technology is used to transfer semiconductor dice, then the process can handle larger devices, but it cannot effectively transfer small semiconductor dice with sizes of 300 um or smaller
Solution Approach 1:
The patent replaces conventional mechanical pick and place systems with an electrostatic transfer printing system. The electrostatic stamp uses electrostatic forces to pick up, transfer, and release small semiconductor dice, eliminating the need for mechanical grippers and positioning mechanisms that cannot handle sub-300 um devices effectively.
Solution Approach 2:
The patent changes the physical parameters of the transfer system by using electrostatic fields instead of mechanical contact. The electrostatic stamp can dynamically adjust the electrostatic force parameters to selectively pick up and transfer dice of specific sizes, enabling effective handling of small semiconductor dice that mechanical systems cannot accommodate.
2Illumination intensity
If high powered LEDs are used to provide illumination, then brightness and efficiency are improved, but thermal management problems and initial costs increase
Solution Approach 1:
The patent extracts the semiconductor dice from their original substrate using electrostatic forces, enabling selective transfer of only the needed components. This allows for optimized LED array configurations that can better manage thermal dissipation while maintaining high brightness performance.
Solution Approach 2:
The electrostatic stamp enables selective transfer and positioning of individual semiconductor dice, allowing for localized optimization of LED arrays. High powered LEDs can be strategically positioned with adequate thermal management spacing, while maintaining overall illumination intensity requirements.
3Use of energy by moving object
If high powered LEDs are used, then illumination efficiency is improved, but initial cost increases
Solution Approach 1:
The patent performs preliminary sorting and selection of semiconductor dice using the electrostatic stamp before final assembly. This allows for optimized matching of high efficiency LEDs with appropriate thermal management structures, ensuring that the highest efficiency components are used where needed while controlling overall device cost.
Solution Approach 2:
The electrostatic transfer printing system enables recovery and reuse of the electrostatic stamp, eliminating the need for expensive disposable handling tools. The system can selectively transfer only the needed high efficiency LEDs, reducing waste and optimizing the balance between performance and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and cost-effective transfer of small semiconductor dice, overcoming thermal management challenges and reducing initial costs by using electrostatic forces to transfer and bond the dice onto the target substrate, facilitating their use in applications like broad area lighting and concentrator photovoltaics.
Implementation Method 1
the series of strata includes a charge transfer outer layer having selected regions electrically charged so as to hold a spatially distributed pattern of charge
Implementation Method 2
transferring semiconductor dice from a host substrate to the electrostatically charged regions of the selected one of the transfer stamp or target substrate by the application of the electrostatic force of the charged regions to the semiconductor dice
Data Source
AI summary
A transfer stamp that can be charged with a spatial pattern of electrostatic charge for picking up selected semiconductor dice from a host substrate and transferring them to a target substrate. The stamp may be bulk charged and then selectively discharged using irradiation through a patterned mask. The technique may also be used to electrostatically transfer selected semiconductor dice from a host substrate to a target substrate.