Multi-Layer Structure for Thermal Conductivity and Rigidity

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Solution Overview

Problem

Compact portable electronic devices face challenges in heat dissipation and electrical grounding due to limited space and component density, requiring improved thermal and electrical conductivity without compromising structural support.

Innovation Solution

A multi-layer structure comprising layers with differing materials, where one layer provides structural rigidity and another layer offers enhanced thermal and/or electrical conductivity, allowing for efficient heat dispersion and electrical coupling through openings in the structural layer, forming an integral metal structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a single-layer structure is used for structural support, then structural rigidity is maintained, but thermal and electrical conductivity is insufficient

Engineering Contradiction:

Improvestructural rigidityVSAvoidheat dissipation capability

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent applies composite materials by combining a structural layer (providing rigidity) with a conductive layer (providing thermal and electrical conductivity). This multi-layer composite structure allows each material to contribute its advantageous properties, resolving the contradiction between structural strength and heat dissipation capability.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent segments the support structure into distinct functional layers: a structural layer for mechanical support and a separate conductive layer for thermal and electrical functions. This segmentation allows each layer to be optimized for its specific purpose without compromising the other.

Inventive Principle:

Principle #1Segmentation

2Temperature

If the multi-layer structure thickness is increased to improve conductivity, then thermal and electrical conductivity enhance, but device compactness is compromised

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructure thickness

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

Instead of increasing thickness in the vertical dimension, the patent distributes conductivity across multiple horizontal layers. The conductive layer is positioned adjacent to the structural layer, creating a planar distribution of thermal and electrical pathways that enhances conductivity without increasing overall thickness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If openings are added to the structural layer for conductivity access, then thermal and electrical conductivity improve, but structural integrity may be compromised

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructural rigidity

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent applies local quality by providing openings in the structural layer only at specific locations where thermal and electrical conductivity is needed, rather than uniformly across the entire structure. This localized approach maintains structural integrity in regions where strength is critical while enabling heat dissipation and electrical connection where required.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances conductivity without increasing thickness, effectively addressing heat dissipation and electrical grounding needs in compact devices while maintaining structural integrity.

Implementation Method 1

at least another layer can primarily provide enhanced conductivity (thermal and/or electrical)... greater ability to disperse generated heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least another layer can primarily provide enhanced conductivity (thermal and/or electrical)... provide an accessible voltage potential (e.g., ground plane)

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8879266B2Thin multi-layered structures providing rigidity and conductivity

Publication Date: 2014.11.04 APPLE INC

AI summary

Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.