Folded Circuit Board Shielding via Conductive Guides

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Solution Overview

Problem

As electronic systems become more densely packed, electromagnetic interference (EMI) between circuit boards poses a significant challenge, affecting the operation of adjacent components and requiring innovative solutions for effective shielding.

Innovation Solution

A folded circuit board design featuring flexible interconnects and conductive folding guides that physically couple and electrically connect multiple circuit boards, providing electromagnetic shielding through a U-shaped configuration of conductive sidewalls and connectors to reduce EMI emissions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If circuit boards are packed closer together to reduce space, then space utilization is improved, but electromagnetic interference between circuit boards increases

Engineering Contradiction:
Improvespace utilizationVSAvoidelectromagnetic interference
Core Design Contradiction:
Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent introduces folding guides as intermediary structures between circuit boards. These folding guides include conductive shielding elements that act as mediators to block electromagnetic interference while allowing the circuit boards to be positioned close together for space efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The folding guides are constructed using composite structures combining conductive materials for shielding with insulating materials. This composite approach enables the folding guides to provide electromagnetic shielding while maintaining mechanical flexibility and electrical isolation where needed.

Inventive Principle:
Principle #40Composite materials

2Ease of operation

If folding guides with curved sidewalls are used to guide flexible interconnects, then ease of operation is improved, but device complexity increases

Engineering Contradiction:
Improveflexible interconnect guidanceVSAvoidfolding guide structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The folding guides are designed to perform multiple functions simultaneously: guiding the flexible interconnect through curved sidewalls, providing electromagnetic shielding through conductive materials, and offering mechanical support. This multi-functionality reduces the need for separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the guiding function and shielding function into a single folding guide structure. The curved sidewalls that guide the flexible interconnect also incorporate conductive shielding elements, combining two previously separate functions into one integrated component.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces electromagnetic radiation leakage by at least 45 dB in the 2.4 GHz and 5 GHz frequency bands, ensuring improved operational stability and reduced EMI interference across a range of frequencies.

Implementation Method 1

One or more folding guides include a curved sidewall configured to guide the flexible interconnect when the first circuit board is folded over the second circuit board. The folding guides are coupled to a plurality of sidewalls configured around a plurality of edges of the first circuit board and second circuit board to reduce electromagnetic leakage of the folded circuit board.

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10939540B2Shielded folded circuit board
Publication Date: 2021.03.02 INTEL CORP
  • US10939540B2 patent drawing
  • US10939540B2 patent drawing
  • US10939540B2 patent drawing

AI summary

A folded circuit board includes a first circuit board and a second circuit board. The first circuit board and second circuit board are coupled together through a flexible interconnect. One or more folding guides are coupled to one of the first circuit board or second circuit board. The one or more folding guides extend beyond a first edge of the one of the first circuit board or second circuit board. The one or more folding guides include a curved sidewall configured to guide the flexible interconnect when the first circuit board is folded over the second circuit board. In one embodiment, the one or more folding guides are grounded to reduce EMI emissions.