Resin Molded Body with Clamping Support Walls for FPC Integration
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Solution Overview
Problem
The existing method for fixing a Flexible Printed Circuit (FPC) to a resin molded body is prone to separation when a pulling force is applied due to the FPC being simply placed between the inner surface of the resin molded body and projections, leading to a weak connection.
Innovation Solution
A molding with an integrated electrode pattern is created, featuring a resin molded body with a first film having an electrode pattern and a lead-out wire, and a band-shaped second film with a lead-out wire, where the resin molded body includes support wall portions that clamp both ends of the second film's base part, securely fixing the lead terminal to the inner surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the FPC is simply placed between the inner surface of the resin molded body and projections, then the structure is simple, but the connection strength is insufficient and the FPC is easily separated when pulling force is applied
Solution Approach 1:
The patent merges the FPC base part with the resin molded body by injecting molten resin into the base part of the FPC during the molding process. This creates an integrated structure where the FPC and resin molded body become one unified component, eliminating the need for separate fixation mechanisms while providing strong mechanical bonding that resists pulling forces.
Solution Approach 2:
The patent performs preliminary positioning of the FPC on the resin molded body before the resin fully solidifies. The FPC is placed in the desired position while the resin is still in molten state, allowing the resin to flow around and secure the FPC base part. This preliminary positioning ensures correct placement before the connection is permanently established through cooling and solidification.
2Ease of manufacture
If the FPC is simply placed between the inner surface of the resin molded body and projections, then the manufacturing process is simple, but the reliability of the connection is poor
Solution Approach 1:
The manufacturing process merges the FPC attachment step with the resin molding process itself. The FPC is positioned on the molded body, and then molten resin is injected to simultaneously form the resin structure and secure the FPC base part. This integrated approach maintains manufacturing efficiency while dramatically improving connection reliability through strong mechanical interlocking.
Solution Approach 2:
The patent creates a composite structure combining the FPC material (typically flexible circuit board material) with the resin molded body material. The injection of molten resin into the FPC base part creates a composite joint that leverages the properties of both materials, providing both flexibility and strong mechanical bonding for reliable connection under pulling forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lead terminal is securely fixed to the inner surface of the resin molded body, preventing separation even under pulling force, and the method allows for reliable manufacturing of the integrated electrode pattern.
Implementation Method 1
a first film (6) that is formed on an inner surface of the resin molded body (2) and that includes an electrode pattern (13) and a first lead-out wire (63)... an exposed adhesive layer for fixing a first lead-out wire (63), which is electrically connected to a second lead-out wire (15) of the second film (4), and an electrode pattern (13), which is electrically connected to the first lead-out wire (63), to the resin molded body (2)
Implementation Method 2
a pair of support wall portions (3) formed integrally with the inner surface of the resin molded body (2) so as to stand on the inner surface of the resin molded body (2) and clamp both ends of a base part (4a) of the second film (4)
Implementation Method 3
injecting molten resin into the cavity as well as an outer-wall recess and inner-wall recesses, which are connected to the cavity and arranged in a region where the second-film receiving recess is connected to the cavity at positions corresponding to both end portions of a base part of the second film, and cooling and solidifying the molten resin
Implementation Method 4
cooling and solidifying the molten resin, thereby forming a pair of support walls integrally with the resin molded body at both end portions of the base part of the second film
Data Source
AI summary
A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.