Borderless Display Panel Flexible Circuit Unit Design
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Solution Overview
Problem
The existing borderless display panel technology relies on complex and costly GOA technology, leading to long production cycles and high manufacturing costs, which is not suitable for the rapidly updating electronic products market.
Innovation Solution
The implementation of a display panel using a flexible circuit unit (Chip On Flex, COF IC) technology, where the gate drive circuit is constructed in the flexible circuit unit, eliminating the need for gate drive circuits on the array substrate, and utilizing stopper plates to restrict the flexible circuit unit within the substrate's boundaries, achieving a four-side borderless design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If GOA technology is used to implement borderless configuration, then the borderless design is achieved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The gate drive circuit is extracted from the array substrate and transferred to a separate flexible circuit unit. This separation eliminates the need for complex GOA technology on the array substrate while achieving the borderless configuration, as the flexible circuit unit handles the gate drive functions externally.
Solution Approach 2:
The display panel is segmented into distinct functional modules: the array substrate for display pixels and the separate flexible circuit unit for gate drive circuits. This segmentation simplifies the array substrate design and enables borderless configuration by placing the drive circuitry outside the display area.
2Shape
If GOA technology is used to implement borderless configuration, then the borderless design is achieved, but the production cycle lengthens
Solution Approach 1:
The gate drive circuit is pre-fabricated on the flexible circuit unit separately from the array substrate. This preliminary action allows parallel processing of the array substrate and flexible circuit unit, significantly reducing the overall production cycle compared to integrating the gate drive circuit directly on the array substrate through GOA technology.
3Shape
If GOA technology is used to implement borderless configuration, then the borderless design is achieved, but the manufacturing cost increases
Solution Approach 1:
By segmenting the gate drive circuit into a separate flexible circuit unit, the manufacturing process can use standard, cost-effective flexible circuit board fabrication techniques rather than the more expensive and complex GOA integration process, thereby reducing manufacturing costs while achieving borderless configuration.
4Loss of time
If flexible circuit unit is used instead of GOA, then the production cycle is reduced, but the device structure becomes more complex
Solution Approach 1:
The flexible circuit unit utilizes thin film flexible circuit board technology, which provides a compact and adaptable structure. This flexible thin film approach reduces the overall device structure complexity compared to rigid GOA integration while enabling faster production through separate fabrication processes.
Data Source
AI summary
The present disclosure provides a display panel and a method of processing a display panel. The display panel comprises a first substrate, a second substrate, a liquid crystal layer, a sealing layer, stopper plates and a flexible circuit unit. The second substrate is disposed opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate. The sealing layer disposed on two ends of the liquid crystal layer, and configured to seal the liquid crystal layer. The stopper plates are disposed at positions of end portions of the first substrate. The flexible circuit unit is attached onto the stopper plate and/or the first substrate.


