Boron Nitride Thermal Sheet Composition for Heat and Adhesion Balance
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Solution Overview
Problem
Existing thermally conductive materials using boron nitride particles face challenges in adhesiveness with the resin, which affects their ability to promote effective heat dissipation in power semiconductor devices.
Innovation Solution
A composition comprising a thermosetting compound, boron nitride particles with specific size ranges, and a surface treatment to enhance the oxygen atom concentration on the surface of the smaller particles, improving their affinity with the resin and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If boron nitride particles are used as filler in thermally conductive materials, then thermal conductivity is improved, but adhesiveness with the resin deteriorates
Solution Approach 1:
The invention changes the surface chemical composition parameter of the boron nitride particles by increasing the oxygen atom concentration on the surface through surface treatment. This parameter change improves the chemical compatibility and bonding between the filler particles and the resin matrix, thereby enhancing adhesiveness while preserving the thermal conductivity benefits of the boron nitride particles.
Solution Approach 2:
The oxygen atoms on the boron nitride particle surface act as an intermediary that facilitates better interaction between the inert boron nitride filler and the organic resin matrix. The increased surface oxygen concentration creates a more compatible interface that improves wetting and adhesion, allowing the filler to effectively transfer heat while being well-bonded to the resin.
2Temperature
If large boron nitride particles are used, then thermal conductivity is improved, but surface smoothness and adhesiveness deteriorate
Solution Approach 1:
The invention applies surface treatment to modify the chemical parameters of large boron nitride particles, increasing their surface oxygen concentration. This enables large particles to maintain good adhesiveness and surface smoothness despite their size, as the improved surface chemistry enhances bonding with the resin and reduces surface defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves a thermally conductive material with enhanced adhesiveness and thermal conductivity, effectively addressing the heat dissipation challenges in power semiconductor devices.
Implementation Method 1
a surface treatment to enhance the oxygen atom concentration on the surface of the smaller particles, improving their affinity with the resin and adhesiveness
Implementation Method 2
a thermally conductive material, which promotes heat dissipation from the power semiconductor device
Data Source
AI summary
An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties and adhesiveness can be obtained. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer. A composition for forming a thermally conductive material of the present invention contains a thermosetting compound A, boron nitride particles B containing boron nitride and having an average particle diameter of 25.0 µm or more, and boron nitride particles C containing boron nitride and having an average particle diameter of 15.0 µm or less, in which an oxygen atom concentration on a surface of the boron nitride particles C detected by X-ray photoelectron spectroscopic analysis is 1.5 atomic% or more.